Demonstration of spatially programmable chemical vapor deposition: Model-based uniformity∕nonuniformity control

Sreenivasan, R.; Adomaitis, Raymond A.; Rubloff, Gary W.

doi:10.1116/1.2359735

Cited by 7 publications

(5 citation statements)

References 8 publications

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“…Utilizing modified equipment, including a turntable substrate holder and a slide with masks, a combinatorial library of VDP films with varying thickness, compositions and orientations was produced within a single deposition run from the monomers 3,3′,4,4′‐biphenyldianhydride (BPDA) and 4,4′‐diamino‐ p ‐ terphenyl 311. Similar combinatorial reactor designs can prove effective in honing in to the right deposition conditions for other CVD polymerization methods without an exhaustive design of experiments 321, 322…”

Section: Unifying Themesmentioning

confidence: 99%

Chemical Vapor Deposition of Conformal, Functional, and Responsive Polymer Films

et al. 2010

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Chemical vapor deposition (CVD) polymerization utilizes the delivery of vapor-phase monomers to form chemically well-defined polymeric films directly on the surface of a substrate. CVD polymers are desirable as conformal surface modification layers exhibiting strong retention of organic functional groups, and, in some cases, are responsive to external stimuli. Traditional wet-chemical chain- and step-growth mechanisms guide the development of new heterogeneous CVD polymerization techniques. Commonality with inorganic CVD methods facilitates the fabrication of hybrid devices. CVD polymers bridge microfabrication technology with chemical, biological, and nanoparticle systems and assembly. Robust interfaces can be achieved through covalent grafting enabling high-resolution (60 nm) patterning, even on flexible substrates. Utilizing only low-energy input to drive selective chemistry, modest vacuum, and room-temperature substrates, CVD polymerization is compatible with thermally sensitive substrates, such as paper, textiles, and plastics. CVD methods are particularly valuable for insoluble and infusible films, including fluoropolymers, electrically conductive polymers, and controllably crosslinked networks and for the potential to reduce environmental, health, and safety impacts associated with solvents. Quantitative models aid the development of large-area and roll-to-roll CVD polymer reactors. Relevant background, fundamental principles, and selected applications are reviewed.

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Section: Unifying Themesmentioning

confidence: 99%

Chemical Vapor Deposition of Conformal, Functional, and Responsive Polymer Films

et al. 2010

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“…The result showed that the profile regulation was finer, and the process quality was continually promoted with the rising of the polynomial order. Adomaitis and coworkers [12][13][14][15] proposed and designed a spatially programmable chemical vapor deposition prototype. This novel solution divided the gas inlet structure into many mass-flow-rate independently controllable sub-regions and then detected the species concentration profile above the wafer by an in situ mass spectrometer to drive the feedback control, which reprogrammed the mass flow rate of each gas inlet to finely regulate the spatial distribution of mass transport.…”

Section: Introductionmentioning

confidence: 99%

New simulation-based approach for the profile control in a process chamber: Fluid, thermal, and plasma profile

Xiang

Xia

Wang

et al. 2015

Proceedings of the Institution of Mechanical Engineers, Part E:

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Process chamber is the core unit of chemical vapor deposition and etching, and the physical fields in it have fatal effect on process quality. It is significant and difficult for improving the process performance to regulate the fields' profiles finely. Two design solutions for the profile regulation are proposed: controllable type and resistance type. A novel profile error feedback method is presented, and a simulation-based auto-design framework is established. The profile error feedback method is in a quasi-closed-loop-control mode. It starts from an initial guessed sequence of the design/control variables and predicts a better sequence via feedback of the profile error between the output-targeted profile and the expected one. It never stops until the profile error is narrowed in the preset tolerance. Three kinds of numerical experiments about the regulation of the thermal, fluid, and plasma profile are set to test the effectiveness and feasibility of the profile error feedback method and the two kinds of design schemes.

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“…In the second example we consider data produced by the Programmable CVD reactor system [5,6,9,10], a reactor designed to test spatially controlled CVD concepts. The main feature of this system is its segmented showerhead design that allows independent control of feed gas composition to each segment.…”

Section: Model Comparison For the Spatially Programable Cvd Reactormentioning

confidence: 99%

“…In Taylor and Semancik [12], microhotplate devices were used to control the temperature in an array of micro-scale substrate samples; it was found that temperature gradients in the microhotplate supports resulted in a microstructurally graded film on the support legs. Finally, the Programmable Reactor system [5,6,9,10] features a segmented shower head design where each segment is fed individually with reactant gases and exhaust gas is pumped back up through each segment. This concept was tested in a three-zone prototype tungsten deposition system to evaluate the system's ability to manipulate gas phase composition across the wafer surface [5,6] and to demonstrate its true programmable nature using a modelbased approach to controlling spatial deposition patterns across the wafer surface [9,10].…”

Section: Combinatorial Cvdmentioning

confidence: 99%

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Full-wafer mapping and response surface modeling techniques for thin film deposition processes

Leon

Adomaitis

2009

Journal of Crystal Growth

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Isr develops, applies and teaches advanced methodologies of design and analysis to solve complex, hierarchical, heterogeneous and dynamic problems of engineering technology and systems for industry and government.Isr is a permanent institute of the university of maryland, within the a. James clark school of engineering. It is a graduated national science foundation engineering research center. AbstractComputational techniques for representing and analyzing full wafer metrology data are developed for chemical vapor deposition and other thin-film processing applications. Spatially resolved measurement data are used to produce "virtual wafers" that are subsequently used to create response surface models for predicting the full-wafer thickness, composition, or any other property profile as a function of processing parameters. Statistical analysis tools are developed to assess model prediction accuracy and to compare the relative accuracies of different models created from the same wafer data set. Examples illustrating the use of these techniques for film property uniformity optimization and for creating intentional film-property spatial gradients for combinatorial CVD applications are presented.

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Demonstration of spatially programmable chemical vapor deposition: Model-based uniformity∕nonuniformity control

Cited by 7 publications

References 8 publications

Chemical Vapor Deposition of Conformal, Functional, and Responsive Polymer Films

Chemical Vapor Deposition of Conformal, Functional, and Responsive Polymer Films

New simulation-based approach for the profile control in a process chamber: Fluid, thermal, and plasma profile

Full-wafer mapping and response surface modeling techniques for thin film deposition processes

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