Curing kinetics and chemorheology of epoxy/anhydride system

Ivanković, Marica; Incarnato, Loredana; Kenny, J. M.; Nicolais, L.

doi:10.1002/app.12976

Cited by 104 publications

(88 citation statements)

References 19 publications

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“…Thereafter, a very rapid increase of the viscosity was observed with obvious gelation. The following plateau in complex viscosity with temperature appeared ascribing to the dynamic modulus [14]. Besides, for DEN/HMMM/EMI-24, when the conversion (a) was below 0.2, the low complex viscosity cannot hinder the diffusion of molecule chains.…”

Section: Analysis Of Chemorheological Behaviormentioning

confidence: 95%

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Curing kinetics, mechanism and chemorheological behavior of methanol etherified amino/novolac epoxy systems

Zhao¹,

Zhang²,

Sun³

et al. 2014

Express Polym. Lett.

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Abstract. The curing kinetics and mechanism of epoxy novolac resin (DEN) and modified epoxy novolac resin (MDEN) with methanol etherified amino resin were studied by means of differential scanning calorimetry (DSC), Fourier transforminfrared (FT-IR) spectroscopy and chemorheological analysis. Their kinetics parameters and models of the curing were examined utilizing isoconversional methods, Flynn-Wall-Ozawa and Friedman methods. For the DEN mixture, its average activation energy (E a ) was 71.05 kJ/mol and the autocatalytic model was established to describe the curing reaction. The MDEN mixture exhibited three dominant curing processes, termed as reaction 1, reaction 2 and reaction 3; and their E a were 70.05, 106.55 and 101.91 kJ/mol, respectively. Besides, E a of reaction 1 was similar to that of DEN mixture, while E a of reactions 2 and 3 corresponded to that of the etherification reaction between hydroxyl and epoxide group. Moreover, these three dominant reactions were n th order in nature. Furthermore, their curing mechanisms were proposed from the results of DSC and FTIR. The chemorheological behavior was also investigated to obtain better plastics products via optimizing the processing schedules.

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Section: Analysis Of Chemorheological Behaviormentioning

confidence: 95%

“…Another widely used model is the autocatalytic expression. Regarding rheological behavior, an advance was made from the correlation between viscosity and temperature that include kinetics and/or structure information [13,14]. However, there are few studies to investigate the kinetic model from chemorheological behavior.…”

Section: Introductionmentioning

confidence: 99%

Curing kinetics, mechanism and chemorheological behavior of methanol etherified amino/novolac epoxy systems

Zhao¹,

Zhang²,

Sun³

et al. 2014

Express Polym. Lett.

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“…The curing of the adhesive can be controlled through its reaction kinetics, which depend on the chemical structure and composition of the adhesive, and the curing temperature. The curing kinetics of our developed epoxy adhesive was studied with a DSC to record the reaction heat and with the following equations 6 :…”

Section: Resultsmentioning

confidence: 99%

Packaging of photonic components VII: the process for coupling optical fibers to planar waveguides with thermal curing adhesives

et al. 2004

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Our developed thermal curing adhesives were reported having excellent performance in coupling optical fibers to waveguides. The fiber-to-waveguide coupling process based on these adhesives was reported in this paper. The process consisted of three major steps in the process, including loading waveguide dies and fiber arrays onto the sample holders, aligning the fibers to waveguides at a constant temperature to reach minimum loss, bonding the fiber arrays to waveguide dies. The sample holders, which used ceramic spaces to isolate heat and springs to damp stress, were specially designed to keep fiber arrays and waveguide dies at a constant temperature up to 120°C with minimum shift. When the fiber arrays and waveguide dies were equilibrated with the set temperature, a rough alignment was conducted manually, followed by an automatic alignment controlled by a Melles Griot system. Then, the adhesives with proper viscosity and curing rate were applied to the gaps between fiber array and waveguide dies to bond them together. The curing temperature was optimized by studying the adhesives' curing kinetics with a DSC, so that the adhesives could be distributed rapidly and cured at a speed that still allowed a small alignment adjustment during the curing. A post-thermal treatment process was developed to build the maximum bonding strength for the fiber-coupled devices.

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“…Springer et.al [1][2] made attempts to model the Heat of Reaction, Degree of Cure, and Viscosity of Hercules 3501-6 Resin, Mantel et.al [3] explained Cure Kinetics and Rheology Models for ICI Fiberite 977-3 and 977-2 Thermosetting Resins, Shamku et.al [4] explained about the rheological studies with the cure temperature for EPON 862/W Epoxy Used in Pultrusion, similarly Hubert and Kim et.al [5][6] explained the cure kinetics and viscosity model of the Hexcel 8552 and 3501-6 materials, these literatures show behavior of resin viscosity with the cure temperature and time. J.M Khenny and Gordana Bogoeva et.al, [7][8] explained the method for evaluating the cure kinetics for the epoxy resins. Vijaya kumar et.al explained the root causes for the deviations that occurs during curing process of fiber composites in an autoclave.…”

Section: Introductionmentioning

confidence: 99%