Cu–Ag and Ni–Ag meshes based on cracked template as efficient transparent electromagnetic shielding coating with excellent mechanical performance

Voronin, A. I.; Fadeev, Yu. V.; Govorun, I. V.; Podshivalov, I. V.; Симунин, М. М.; Тамбасов, И. А.; Karpova, D. V.; Smolyarova, T. E.; Lukyanenko, A. V.; Karacharov, Anton; Немцев, И. В.; Khartov, S. V.

doi:10.1007/s10853-021-06206-4

Cited by 31 publications

(49 citation statements)

References 77 publications

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“…Our previous work [23] describes the method for preparing an egg white precursor in detail. The egg white precursor for the cracked template was prepared according to the following procedure: in a fresh chicken egg, the white was separated from the yolk, then the white was thrown onto a coarse sieve with a mesh period of 500 µm.…”

Section: Cracked Template Preparationmentioning

confidence: 99%

“…Such methods can significantly reduce the cost of coating production and achieve high optoelectric parameters and SE. The following solutions can be cited as example: cracked template Ag mesh [22] and Cu-Ag; Ni-Ag meshes [23]; and Ag nanoparticle mesh emulsion template [24]. An important feature of the cracked template is the non-periodic mesh structure; therefore, in a multilayer version, the system will not have a moiré pattern [21,23], which is typical for the imposition of periodic meshes [19].…”

Section: Introductionmentioning

confidence: 99%

“…The follo be cited as example: cracked template Ag mesh [22] and Cu-Ag; Ni-A Ag nanoparticle mesh emulsion template [24]. An important feature o plate is the non-periodic mesh structure; therefore, in a multilayer v will not have a moiré pattern [21,23], which is typical for the imp meshes [19].…”

Section: Introductionmentioning

confidence: 99%

“…This paper proposes a simple strategy for producing embedded C by electroplating copper on a Cu seed mesh formed based on a cra lowed by embedding in a photocurable resin (Figure 1). From an economic point of view, Cu seed mesh is more profitable than Ag seed mesh, which we used in [23]. The technological process of embedding a mesh into a photocurable resin layer contributes to a significant increase in the mechanical adhesion properties of the coating.…”

Section: Introductionmentioning

confidence: 99%

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Low Cost Embedded Copper Mesh Based on Cracked Template for Highly Durability Transparent EMI Shielding Films

et al. 2022

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Embedded copper mesh coatings with low sheet resistance and high transparency were formed using a low-cost Cu seed mesh obtained with a magnetron sputtering on a cracked template, and subsequent operations electroplating and embedding in a photocurable resin layer. The influence of the mesh size on the optoelectric characteristics and the electromagnetic shielding efficiency in a wide frequency range is considered. In optimizing the coating properties, a shielding efficiency of 49.38 dB at a frequency of 1 GHz, with integral optical transparency in the visible range of 84.3%, was obtained. Embedded Cu meshes have been shown to be highly bending stable and have excellent adhesion strength. The combination of properties and economic costs for the formation of coatings indicates their high prospects for practical use in shielding transparent objects, such as windows and computer monitors.

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Section: Cracked Template Preparationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Low Cost Embedded Copper Mesh Based on Cracked Template for Highly Durability Transparent EMI Shielding Films

et al. 2022

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“…There has been widespread demand for metal micro/nanostructures because of their wide-ranging applications and significance [1][2][3][4][5]. To meet this demand, photolithographic processes involving additional metal deposition, such as sputtering and evaporation, have been used extensively for the fabrication of micro/nanoscale structures, owing to their high quality and resolution.…”

Section: Introductionmentioning

confidence: 99%

Direct Laser Interference Ink Printing Using Copper Metal–Organic Decomposition Ink for Nanofabrication

Park

Lee

et al. 2022

Nanomaterials

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In this study, we developed an effective and rapid process for nanoscale ink printing, direct laser interference ink printing (DLIIP), which involves the photothermal reaction of a copper-based metal–organic decomposition ink. A periodically lined copper pattern with a width of 500 nm was printed on a 240 μm-wide line at a fabrication speed of 17 mm/s under an ambient environment and without any pre- or post-processing steps. This pattern had a resistivity of 3.5 μΩ∙cm, and it was found to exhibit a low oxidation state that was twice as high as that of bulk copper. These results demonstrate the feasibility of DLIIP for nanoscale copper printing with fine electrical characteristics.

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Shorted Micro‐Waveguide Array for High Optical Transparency and Superior Electromagnetic Shielding in Ultra‐Wideband Frequency Spectrum

Liang

Huang

Pan

et al. 2023

Adv Materials Technologies

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While functional materials with both light transmitting and electromagnetic shielding are highly desirable and have made rapid advancements, only very few of them meet the stringent electromagnetic interference (EMI) shielding criteria for optoelectronic systems. Achieving high optical transparency and superior EMI shielding in a broad frequency spectrum is a remaining challenge in both academic and industrial areas. Herein, a design strategy of shorted micro‐waveguides (SMWs) array to decouple the light transmission and EMI shielding is proposed and experimentally demonstrated. The array of SMWs, consisting of cutoff metallic micro‐waveguides and shorting indium tin oxide (ITO) continuous conductive film, exhibits high optical transmittance of 90.4% and superior EMI shielding effectiveness of 60.8 dB on average over ultra‐wide frequency spectrum (0.2–1.3 GHz & 1.7–18 GHz). Compared to previously reported works, an improvement of 17 dB in average shielding effectiveness is achieved under the same level of light transmission, and the shielding frequency spectrum is significantly expanded. The working principle is explained in depth and factors influencing the performance are investigated for design optimization. These outstanding properties enable the transparent shielding material based on SMWs to excel in future applications of EMI shielding for optoelectronic systems.

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Cu–Ag and Ni–Ag meshes based on cracked template as efficient transparent electromagnetic shielding coating with excellent mechanical performance

Cited by 31 publications

References 77 publications

Low Cost Embedded Copper Mesh Based on Cracked Template for Highly Durability Transparent EMI Shielding Films

Low Cost Embedded Copper Mesh Based on Cracked Template for Highly Durability Transparent EMI Shielding Films

Direct Laser Interference Ink Printing Using Copper Metal–Organic Decomposition Ink for Nanofabrication

Shorted Micro‐Waveguide Array for High Optical Transparency and Superior Electromagnetic Shielding in Ultra‐Wideband Frequency Spectrum

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