Creep of Polycrystalline Tin

Breen, J E; Weertman, J.

doi:10.1007/bf03379034

Cited by 33 publications

(41 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The slope in both purities of tin changes in Z value of around 18, and m value in the region of low Z value is around 4.9. The most of a dynamic recovery type of metals yield m value below 5.0, and the stress exponent value in tin obtained in the past creep studies were 4.6 to 6.6, 5,8,9) and these results coincide with m value obtained in the present study. S-S curves and their variations with the deformation condition in tin evidently indicate that tin belongs to a dynamic recovery type of metals, and so relatively high m obtained in the present study or other creep studies may possibly associate with very lower activation energy for hot deformation or creep compared with that of self diffusion of tin as noted above, although it is not easy to explain how to relate m value and the activation energy.…”

Section: )supporting

confidence: 91%

“…5,6,9) The microstructure evolved by hot deformation in a dynamic recovery type of metal is constituted by subgrains which are formed by dislocation climb. 14) Dynamic recovery process in tin is controlled by such a high speed diffusion as grain boundary diffusion or pipe diffusion.…”

Section: Dynamic Restoration Behavior In Pure Lead and Tinmentioning

confidence: 99%

“…As metals with the low melting point appear to have the low recrystallization temperature, one of candidate materials which can substitute for lead is tin with the low melting point of 505 K. Basic studies of static recrystallization and creep in metals with the low melting point such as lead or tin were mostly conducted before 1980's, [4][5][6][7][8][9] but systematic investigations of both dynamic and static restoration processes in these metals which occur in deformation at the higher strain rate over that in creep have not been conducted. The ambient temperature range in a plug used for seismic isolation may be from 233 to 315 K which covers the arctic region to very hot region considering a world wide construction of bridges and other structures.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Dynamic and Static Restoration Behaviors of Pure Lead and Tin in the Ambient Temperature Range

et al. 2007

View full text Add to dashboard Cite

Dynamic and static restoration behaviors of pure lead and tin were investigated by compression tests, and the deformation temperature and strain rate were varied in the range from 223 to 348 K and from 2 Â 10 À3 to 1 s À1 , respectively. Lead and tin used had two purity levels of 99.999% (5N) and 99.9% (3N), and 5N and 4N, respectively. The hot working simulator was reformed so as to enable compression tests at low temperatures ranged from 223 to 273 K. S-S curves observed in lead and tin were those in dynamic recrystallization and dynamic recovery types of metals, respectively, of which activation energies were 92 to 119 kJ/mol in lead and 49 to 52 kJ/mol in tin. Steady state flow stress in lead with 5N purity was lower than that of tin with 5N purity. A reduction of purity level from 5N to 3N in lead significantly increased flow stress, but difference in purity level of 5N and 4N in tin exerted tiny influence on flow stress at strain rate below 1 Â 10 À1 s À1 . Static recrystallization in lead with 5N purity completed in the holding time of less than 600 s even at 273 K, while tin with the same purity showed a slightly retarded recrystallization progress. A reduction of purity level in both metals extended the time period for completion of recrystallization by more than 2 orders.

show abstract

Section: )supporting

confidence: 91%

Section: Dynamic Restoration Behavior In Pure Lead and Tinmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Dynamic and Static Restoration Behaviors of Pure Lead and Tin in the Ambient Temperature Range

et al. 2007

View full text Add to dashboard Cite

show abstract

“…It will reduce the activity of Sn by forming solid solution hardening and particle hardening of Sb rich β-Sn phase, resulting in refinement of the grain size, and thus improved the creep resistance as reported by Chen et al [15]. However, the change in creep behavior with temperature is consistent with the observations of Song and Morris [21], Breen and Weertman [26], Suh et al [27], and Poirie [28]. They noted significant changes in creep behavior of Sn-rich solders at about 100˚C.…”

Section: Stress Dependence Of Minimum Creep Ratesupporting

confidence: 82%

Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

Eid¹,

Ramadan²,

Basaty³

2018

ENG

View full text Add to dashboard Cite

The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb containing solder alloy. The stress exponents, n, were found to be around 3.7 for all soldiers at 130˚C. The stress exponent increases as the temperature drops from 100˚C to 50˚C, except for the 1.0% Sb alloy, where n 5.3 -6.1 at all the temperature range (T = 50˚C, 100˚C and 130˚C). The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening.

show abstract

“…While the literature on the creep of pure Sn is not entirely consistent, there are indications of thermal anomalies in several published reports. In particular, Breen and Weertman, 9) Suh et al, 10) and Poirier 11) all noted significant changes in the creep behavior of bulk Sn at about 100 • C, evidenced by a change in the activation energy for steady-state creep from above 100 to below 50 kJ/mol. Frenkel et al 12) and Mohamed et al 13) confirm the high-temperature value of the activation energy, while reasonable.…”

Section: Discussionmentioning

confidence: 98%

Anomalous Creep in Sn-Rich Solder Joints

2002

View full text Add to dashboard Cite

This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni/Au metallized pads. The creep behavior of these joints was measured over the range 60-130 • C. The four solders show the same general behavior. At all temperatures their steady-state creep rates are separated into two regimes with different stress exponents (n). The low-stress exponents range from ∼3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 • C. The anomalous behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Surprisingly, however, very similar behavior is found in Sn-10In-3.1Ag, whose primary constituent is γ -InSn. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent is due to a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

show abstract

Creep of Polycrystalline Tin

Cited by 33 publications

References 7 publications

Dynamic and Static Restoration Behaviors of Pure Lead and Tin in the Ambient Temperature Range

Dynamic and Static Restoration Behaviors of Pure Lead and Tin in the Ambient Temperature Range

Enhancing the Creep Resistance of Sn-9.0Zn-0.5Al Lead-Free Solder Alloy by Small Additions of Sb Element

Anomalous Creep in Sn-Rich Solder Joints

Contact Info

Product

Resources

About