Correlation of reliability models including aging effects with thermal cycling reliability data

Motalab, Mohammad; Mustafa, M. T.; Suhling, Jeffrey C.; Zhang, Jiawei; Evans, John L.; Bozack, Michael J.; Lall, Pradeep

doi:10.1109/ectc.2013.6575694

Cited by 81 publications

(27 citation statements)

References 37 publications

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“…Zhang and coworkers [9][10] have shown that large reductions in the thermal cycling reliability of BGA test assemblies occurs when they are subjected to aging prior to accelerated life testing. Motalab, et al [11][12][13] have included aging effects in the Anand constitutive model and energy density based failure criterion for SAC solders, and then used these theories with finite element analyses to predict the thermal cycling life of aged BGA assemblies. Good correlations were achieved with the measured lifetimes from references [9][10].…”

Section: Introductionmentioning

confidence: 99%

“…Aging effects on the constitutive and failure behaviors of lead free solders have been studied extensively by the authors and their coworkers [2][3][4][5][6][7][8][9][10][11][12][13][14]. In early investigations, the mechanical properties and creep behavior of SAC alloys were shown to be severely degraded by prior exposure to room temperature (25 C) and elevated temperature (50, 75, 100, and 125 C) aging [2][3][4][5][6].…”

Section: Introductionmentioning

confidence: 99%

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Nanomechanical characterization of SAC solder joints - reduction of aging effects using microalloy additions

Hasnine

Suhling

Prorok

et al. 2015

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

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In this work, we have examined the ability of microalloy additions (dopants) to reduce aging effects in solder joints by nanoindentation testing of several sets of doped/non-doped alloys. The investigated solder joint alloys included SAC105, SAC105+Ni, and SAC105+Mn. For the doped alloys, the base SAC105 solder in the PBGA component solder balls was modified by microalloying an additional small amount (< 0.05%) of the dopant material (Ni, Mn, etc.). The tested joints were extracted from 14 x 14 mm PBGA assemblies (0.8 mm ball pitch, 0.46 mm ball diameter) that were part of the iNEMI Characterization of Pb-Free Alloy Alternatives Project. After extraction, the joints were then subjected to various aging conditions at high temperature (0-6 months aging at T = 125 o C). After aging, the joints were loaded in the nanoindentation system, and the load-deformation behavior during indentation was used to characterize the mechanical properties of the solder joints for various aging conditions including modulus, hardness, and yield stress. Using constant force at max indentation, we have also measured the creep response of the aged and non-aged solder joint materials for various stress levels. With this approach, we have been able to quantify aging effects in joints and compare the behavior of the standard and doped alloys.Our results have shown that addition of the microalloy elements significantly reduced the aging degradations of the mechanical properties and creep resistance in the joints. For example, the average reduction of the effective elastic modulus of SAC105 joints was 32.9% with 180 days of aging, while the analogous average reductions were 7.0% and 8.1% for the SAC105+Ni and SAC105+Mn joints. Similarly, the average hardness (yield stress) degradation for the SAC105 joints was 45.9%, while those for the SAC105+Ni and SAC105+Mn were 10.5% and 10.7%, respectively. Finally, the creep rate increased 69.1X for the aged SAC105 joints, while the creep rate degradations for the SAC105+Ni (6.5X) and SAC105+Mn (9.0X) were an order of magnitude smaller. Our findings have also suggested that the addition of Ni was slightly more effective than Mn for the SAC105+X dopants.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Nanomechanical characterization of SAC solder joints - reduction of aging effects using microalloy additions

Hasnine

Suhling

Prorok

et al. 2015

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

Self Cite

View full text Add to dashboard Cite

show abstract

“…This could have a detrimental effect on the reliability of solder joints [3]. Lee et al [4] studied the relationship between isothermal aging and the reliability of fine-pitch ball grid array (BGA) packages with Sn3.0Ag0.5Cu solder joints during thermal cycling.…”

Section: The Influence Of Aging On Reliability Of Snagcu Solder Jointsmentioning

confidence: 99%

“…Recently, Motalab et al [3] developed a revised set off Anand viscoplastic stressstrain relationships and aging aware failure criteria for Sn3.0Ag0.5Cu alloy. In order to study how aging influences the nine parameters of Anand model, the samples were aged for eight different aging times up to 12 months at 100…”

Section: Review: Solder Joint Reliability Predictionmentioning

confidence: 99%

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Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy

Singh

Subbarayan

2017

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystem

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Application of Nanoindentation and Microdiffraction to Study Aging Effects in Lead Free Solder Interconnects

Hasnine

Suhling

Prorok

et al. 2016

MEMS and Nanotechnology, Volume 5

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Correlation of reliability models including aging effects with thermal cycling reliability data

Cited by 81 publications

References 37 publications

Nanomechanical characterization of SAC solder joints - reduction of aging effects using microalloy additions

Nanomechanical characterization of SAC solder joints - reduction of aging effects using microalloy additions

Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy

Application of Nanoindentation and Microdiffraction to Study Aging Effects in Lead Free Solder Interconnects

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