2018
DOI: 10.1371/journal.pone.0200084
|View full text |Cite
|
Sign up to set email alerts
|

Copper conductive patterns through spray-pyrolysis of copper-diethanolamine complex solution

Abstract: A simple and low-cost method to fabricate copper conductive patterns at low temperature is critical for printed electronics. Low-temperature spray-pyrolysis of copper-alkanolamine complex solution shows high potential for this application. However, the produced copper patterns exhibit a granular structure consisting of connected fine copper particles. In this work, low-temperature spray-pyrolysis of copper formate-diethanolamine complex solution under N2 flow at a temperature of 200 °C was investigated. The ef… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2020
2020
2022
2022

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 39 publications
0
1
0
Order By: Relevance
“…Many of the advantages of these inks are derived from their molecular nature, and thus molecular tailoring of the amine ligand may be used to improve the stability and printability of the ink. For instance, the basicity, degree of steric hindrance, molecular weight, and stoichiometry of amine ligands bound to copper formate have been shown to govern the copper particle sizes, film morphologies, and porosity that ultimately determine the electrical properties of the copper films. …”
Section: Introductionmentioning
confidence: 99%
“…Many of the advantages of these inks are derived from their molecular nature, and thus molecular tailoring of the amine ligand may be used to improve the stability and printability of the ink. For instance, the basicity, degree of steric hindrance, molecular weight, and stoichiometry of amine ligands bound to copper formate have been shown to govern the copper particle sizes, film morphologies, and porosity that ultimately determine the electrical properties of the copper films. …”
Section: Introductionmentioning
confidence: 99%