2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2024
DOI: 10.1109/eurosime60745.2024.10491471
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CoolStar: A New Approach to Automotive HPC Cooling with Improved Thermo-Mechanical Design

Baris Erol,
Daniel May,
Bernhard Wunderle
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