Controllable reduction of graphene oxide and its application during the fabrication of high dielectric constant composites

Shen

Beilstein J. Nanotechnol.

et al. 2018

The detection of local dielectric properties is of great importance in a wide variety of scientific studies and applications. Here, we report a novel method for the characterization of local dielectric distributions based on surface adhesion mapping by atomic force microscopy (AFM). The two-dimensional (2D) materials graphene oxide (GO), and partially reduced graphene oxide (RGO), which have similar thicknesses but large differences in their dielectric properties, were studied as model systems. Through direct imaging of the samples with a biased AFM tip in PeakForce Quantitative Nano-Mechanics (PF-QNM) mode, the local dielectric properties of GO and RGO were revealed by mapping their surface adhesion forces. Thus, GO and RGO could be conveniently differentiated. This method provides a simple and general approach for the fast characterization of the local dielectric properties of graphene-based materials and will further facilitate their applications in energy generation and storage devices.

Section: Resultssupporting

confidence: 63%

Nanoscale mapping of dielectric properties based on surface adhesion force measurements

Shen

Beilstein J. Nanotechnol.

et al. 2018

“…When the results of the dielectric behaviour of the composites of BaTiO 3 and PPy are compared with those of the previously published similar PPy composites [33,34,64,65,66,67] we find that such results have been obtained either through the higher weight or volume percentages of the filler into PPy or by the addition of a third component. These methods induce brittleness and high dielectric losses and make the processing conditions expensive and difficult.…”

Section: Resultsmentioning

confidence: 55%

Synthesis and Characterization of BaTiO3/Polypyrrole Composites with Exceptional Dielectric Behaviour

et al. 2018

Higher concentrations of ceramic fillers induce brittleness in the ceramic/polymer hybrids which restrict their applications to limited fields especially when such hybrids are prepared for their use as dielectrics. We have synthesized and characterized different BaTiO3-polypyrrole (PPy) composites by changing the concentration of BaTiO3 from 1% by weight of PPy taken to 5 wt % to explore its effect on the dielectric parameters of the final product and found that the BaTiO3-polypyrrole composite with weight ratio of 0.05:1 exhibited highest dielectric constant, lowest dielectric loss and thermally most stable. All the composites were prepared using in-situ polymerization of pyrrole in an aqueous dispersion of low content of BaTiO3 in the presence of small amount of Hydrochloric acid. These composites were characterized for their microstructure and crystallinity by X-ray diffractometer (XRD), Fourier transform infrared (FT-IR) spectroscopy and scanning electron microscopy (SEM) while thermal stability by thermo gravimetric (TGA) analysis. An impedance analyser (LCR meter) was utilized to investigate the dielectric parameters. FT-IR data confirmed the presence of the two phases and their interaction, inferred from the shifting of normal PPy peaks. The data obtained from XRD confirmed the presence of crystallites of 2.8 to 5 nm with dominant crystallinity of the filler, TGA analysis (25 to 600 °C) confirmed the higher thermal stability induced on successive addition of the filler into the prepared composites as compared to that of pure PPy in a wide temperature range which is unusual for such a low % age addition of the filler. The SEM analysis together with XRD results reveal that the successive introduction of BaTiO3 particles produced crystallites of 2 to 5 nm size which bonded together and changed the hemispherical shaped larger grains of the matrix to regular shaped smaller grains. The dielectric constant of the composites was enhanced with filler contents from 178 to 522 at 1 MHz for 1 wt % and 5 wt % BaTiO3 respectively. It was concluded that the introduction of BaTiO3 into the polymer matrix with this new procedure has greatly affected the polymerization process, thermal stability, morphology and dielectric properties of the host matrix and has resulted in a novel series of the composites which may have broad applications.

High Performance Polymers

“…12–14 Nevertheless, graphene/polymer-based composites generally have a larger dielectric permittivity and dielectric loss owing to the interface polarization and leakage current caused by the high specific area of graphene. 15,16 Zhang added the solvothermally reduced graphene oxide with the 2 wt% content to the PI, the dielectric permittivity and dielectric loss tangent of composite film were about 30 and 8 at 10 3 Hz, respectively. 17 It is a serious obstacle to the rapid transfer of electronic signals in electronic packaging materials.…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity of polyimide composite film filled with hybrid fillers

Ruiyi

Ding

et al. 2021

In this article, the polyimide (PI) composite films with synergistically improving thermal conductivity were prepared by adding a few graphene nanoplatelets (GNP) and various hexagonal boron nitride (h-BN) contents into the PI matrix. The thermal conductivity of PI composite film with 1 wt% GNP and 30 wt% h-BN content was 1.21 W(m·k)− 1, which was higher than that of the PI composite film with 30 wt% h-BN content (0.45 W(m·k)− 1), the synergistic efficiency of GNP under various h-BN content (10 wt%, 20 wt%, and 30 wt%) were 1.70, 2.71, and 3.09, respectively. And it was found that the increased h-BN content can suppress the dielectric properties caused by GNP in the matrix. The dielectric permittivity and dielectric loss tangent of 1 wt% GNP/PI composite film were 10.69, 0.661 at 103 Hz, respectively, and that of the 30 wt% h-BN + GNP/PI composite film were 4.29 and 0.1367, respectively. Moreover, the mechanical properties of the PI composite film were suitable for practical applications. And the heat resistance index and the residual rate at 700°C of PI composite film increased to 326.8°C, 74.43%, respectively, and these of PI film were 292.6°C and 59.26%. Thus, it may provide a reference value for applying the filler hybridization/PI film in the electronic packaging materials.