Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials

Sheng, Aaron; Khuje, Saurabh; Li, Zheng; Yu, Jian; Ren, Shenqiang

doi:10.1021/acsaelm.2c01150

Cited by 10 publications

(11 citation statements)

References 27 publications

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“…The adhesion of the inkjet-printed Cu to the substrates has been a significant challenge due to the solvents, surface/liquid interactions, and sintering limitations. Researchers have tried to pretreat the ink or substrate by adding cellulose to increase the adhesion of printed Cu to the substrates . Here, the adhesion test of dry-printed Cu films to the substrate was performed according to the American Society for Testing and Materials (ASTM D3359) procedure.…”

Section: Resultsmentioning

confidence: 99%

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Ahmadi,

Patel,

Hill

et al. 2024

ACS Appl. Electron. Mater.

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Additive manufacturing of functional devices on various rigid and flexible substrates is rising rapidly due to their design flexibility, rapid manufacturing, and lower cost. Current printing technologies are ink-based and focused on printing silver (Ag) as conductive lines due to its matured ink formulation process, low sintering temperature, ease of printing, and low oxidation rate. However, Ag is the 68th most abundant element on Earth, while copper (Cu) is the 25th, making it much cheaper (>100×) while having a comparable conductivity to Ag. Therefore, printing Cu has become technologically and economically more attractive than Ag. Nevertheless, Cu printing is still a significant challenge in ink-based printing methods due to the higher sintering temperature relative to the glass-transition temperature of most flexible substrates, the higher oxidation rate, the challenging ink formulation process, and ink stability concerns. Here, we demonstrate printing highly conductive Cu on flexible polyimide substrates using a dry printing technique. Cu nanoparticles (∼3–30 nm) are generated by on-demand laser ablation of a solid Cu target inside the printer head and under argon background gas. These Cu nanoparticles are then transported through a nozzle and onto the substrate, where they are laser-sintered in real time. The argon gas plays three critical roles in laser plume condensation for nanoparticle generation, transport, and sheath gas to avoid oxidation during sintering. The sintered nanoparticles thus show high electrical conductivity and mechanical stability under static and cyclic tests. Our dry printing technique can potentially revolutionize how electronic devices and sensors are additively manufactured for earth and space applications.

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Section: Resultsmentioning

confidence: 99%

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Ahmadi,

Patel,

Hill

et al. 2024

ACS Appl. Electron. Mater.

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“…Extensive studies on CuF‐AMP MOD has been done in one of our recent works. [ 42 ] Independently, nickel formate (NiF) was mixed with 1‐amino‐2‐propanol (AmIP) ligand in a molar ratio of 1:4, with subsequent centrifugation in Thinky Mixer for achieving a uniform mixture. CuF‐ and NiF‐MODs were then mixed together at a 1:1 Cu:Ni molar ratio (e.g., 3.14 g of CuF‐AMP MOD and 2.6 g NiF‐AmIP MOD) to make CuNi‐MOD.…”

Section: Methodsmentioning

confidence: 99%

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

Khuje,

Alshatnawi,

Smilgies

et al. 2023

Adv Funct Materials

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As the modern electronic technology extends into operating in harsh working conditions, it calls for a system that is capable of uncompromising performance in extreme environments, thus providing a strong motivation to look for advanced materials and electronics with the capability of high‐throughput and rapid prototyping. Coupled with additive manufacturing, molecular decomposition metals bypass the challenging oddities of traditional material‐limited and thermally initiated metalworking, enabling high throughput and rapid prototyping of stoichiometry and composition‐controlled metals. Here, a new paradigm for the design and additive manufacturing of copper metallic alloy materials onto ceramics is described by printing molecular decomposable metal materials, capable of withstanding thermo‐mechanical loading, operating in extreme environments in static and dynamic conditions. The resulting printed hybrid electronics are electrically stable for 25 h of aging at 1000 °C. This curious fact paves a way for printed antenna and sensor electronics that reliably operate up to 1000 °C. These results can be further extended to establish other printable molecular decomposable materials as a platform for rapid prototyping of high temperature electronics that are suitable for harsh environments.

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“…Copper formate tetrahydrate (CuF) was mixed with aminomethyl propanol (AMP) in a 1:2 molar ratio followed by mixing at 2000 rpm for a duration of 8 min in a Thinky Mixer ARE-310. Extensive studies on CuF-AMP MOD inks were reported in our previous works . To this mixture, platinum(II) acetylacetonate was added, with the resulting mixtures having molar ratios of 2:1, 4:1, 6:1, 8:1, and 10:1 (the left digit indicating the copper ratio and the right digit indicating the platinum ratio).…”

Section: Experimental Methodsmentioning

confidence: 99%

“…Extensive studies on CuF-AMP MOD inks were reported in our previous works. 28 To this mixture, platinum(II) acetylacetonate was added, with the resulting mixtures having molar ratios of 2:1, 4:1, 6:1, 8:1, and 10:1 (the left digit indicating the copper ratio and the right digit indicating the platinum ratio). The mixture was mixed again in the Thinky Mixer for a duration of 2 min at 2000 rpm prior to printing.…”

Section: Copper−platinum (Cu−pt) Ink Preparationmentioning

confidence: 99%

High-Temperature Electronics Enabled by Copper–Platinum and Polymer-Derived Silicon Oxycarbide through Additive Manufacturing

Khuje,

Yu,

Ren

2023

ACS Appl. Eng. Mater.

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High-temperature capable materials are necessary for emerging extreme environment applications. Considering that a foreboding challenge with contemporary materials technology is their stability and reliability under extreme conditions, this calls for advanced functional materials with electrical conductivity and oxidation resistance under high temperatures. Herein, we demonstrate the stoichiometric tailoring of copper bimetallic conductors coupled with additive manufacturing and pyrolysis of preceramic polymer substrates, enabling high-temperature printed sensor electronics. The resulting bimetallic alloy provides electrical stability at 1000 °C for a duration of 25 h, while incorporation of preceramic polymer-derived silicon oxycarbide as the piezoresistive element enables pressure sensing at 1000 °C with a sensitivity of 0.35 kPa–1.

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Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials

Cited by 10 publications

References 27 publications

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

High-Temperature Electronics Enabled by Copper–Platinum and Polymer-Derived Silicon Oxycarbide through Additive Manufacturing

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