“…Therefore, several heat-transfer enhancement techniques have been introduced and applied to improve the thermal response of PCM-based TES systems [ 24 , 25 ]. These techniques include incorporating fins and extended surfaces [ 26 , 27 , 28 , 29 ], modifying the geometry [ 30 , 31 , 32 ], embedding porous structures [ 33 , 34 , 35 , 36 , 37 ], composing thermally high conducting particles [ 38 , 39 , 40 , 41 ], using multiple PCMs [ 42 , 43 ], nano-encapsulation [ 44 , 45 , 46 ], and using the combinations of different methods [ 43 , 47 ]. Among them, incorporating with fins is a particularly attractive option from both economic and engineering perspectives.…”