Comparative creep characteristics of structural glulam wood adhesives

George, B.; Simon, Catalin Petru; Properzi, M.; Pizzi, A.; Elbez, G.

doi:10.1007/s00107-002-0348-3

Cited by 40 publications

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“…Some of the tested one-component polyurethane (1C PUR) adhesives significantly lost strength from 70°C, others reached a good thermal stability up to high temperatures. Phenol-resorcinol-formaldehyde (PRF) resins showed an initial decrease of strength at around 180-190°C. Investigations on the creep behaviour of adhesive bonds were carried out by George et al (2003) and Na et al (2005), whereas a temperature dependant creep of PUR adhesives was found between 40 and 80°C. In the case of a higher initial strength (caused by a higher content of isocyanate), the creep in the low temperature range up to 50°C could be reduced.…”

Section: Introductionmentioning

confidence: 99%

Thermal stability of glued wood joints measured by shear tests

2010

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The thermal stability of glued wood joints is an important criterion to determine the suitability of adhesives in the field of engineered wood. During their product life, glued wood joints can be exposed to high temperatures in various ways (direct exposure to the sun, fire, etc.). Thereby the cohesiveness of the adhesive must not degrade. This raises the question of how the strength of bonding changes under thermal load. The current investigation covers the influence of temperature (T = 20 to 220°C) on the shear strength of glued wood joints. Different adhesive systems were investigated. With increasing temperature, the shear strength of solid wood and also of glued wood joints decreased. There were big differences in thermal stability and failure behaviour between the adhesive systems as well as within the polyurethane group. The thermal stability of one-component polyurethane systems can be greatly varied by modifying their chemical structure. Well adapted onecomponent polyurethane adhesives reach a strength similar to that of phenol resorcinol resin.

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Section: Introductionmentioning

confidence: 99%

Thermal stability of glued wood joints measured by shear tests

2010

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“…Clear, defect-free specimens of spruce were used, all from the same 107-year-old log. The specimen specifications were: dry density ϭ 0.46 Ϯ 0.031 g/cm 3 ; number of annual growth rings per centimeter ϭ 4.55 Ϯ 1.59; average growth ring width ϭ 2.45 Ϯ .85 mm; average growth ring angle ϭ 16.5°Ϯ 8.5°. The concentration of adhesive used was 180 g/m 2 for all the adhesives.…”

Section: Introductionmentioning

confidence: 99%

Structure–property relationships in one‐component polyurethane adhesives for wood: Sensitivity to low moisture content

Beaud

Niemz

Pizzi

2006

J of Applied Polymer Sci

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ABSTRACT:The causes of strength loss of wood joints and their consequent delamination from one-component polyurethane adhesives used for bonding structural wood when used at a low moisture content was investigated by testing wood joint strength and elongation at rupture at different wood moisture contents and by 13 C-NMR spectroscopy and scanning electron microscopy of the hardened bond line. The combination of the relative proportion of the still-reactive free ONCO groups on the polyurethane, of the wise choice of degree of polymerization of the resin, and of a slower rate of reaction were the three parameters found to be important in overcoming the problem of poor or no bonding of wood at low to very low moisture contents from one-component polyurethane adhesives. The results obtained indicated that one-component polyurethane adhesives that had a combination of a higher proportion of still-unreacted ONCO groups, a lower degree of polymerization, and a slower reaction rate were capable of overcoming the problem of the high sensitivity of polyurethane gluing at low to very low wood moisture contents.

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“…The fact that two of the six adhesive brands tested showed early failure even on close contact joints provides clear evidence that temperatureinduced failure can be a critical phenomenon for 1 P PUR adhesives, which is also stated in. [13,14] Even if the development of thermal creep depends on specific characteristics of the single adhesive brands, as also shown in, [16,17] these properties need to be characterised in a more transparent way with test conditions that simulate heat stresses as they develop/appear in practice. The heat resistance test [22] has proved to be relatively simple, fast and indicative.…”

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confidence: 99%

Thermal Stability of Wood‐Wood and Wood‐FRP Bonding with Polyurethane and Epoxy Adhesives

Richter

Steiger

2005

Adv Eng Mater

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The performance of PUR and EP adhesives in wood bonds at increased temperatures is discussed. DTMA and mechanical tests show that glue‐line thickness and adhesive formulation are decisive for PUR‐bond safety, confirming that any application must be restricted to close contact joints. EP adhesives show strength reductions at temperatures above 60 °C. Up to this temperature high viscous adhesives/modifications perform better than low viscous products. As for PUR, only some products had sufficient strength and stiffness above 70 °C. Best‐adapted adhesives for a specific application must be selected in function of the expected temperature range in service.

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Comparative creep characteristics of structural glulam wood adhesives

Cited by 40 publications

References 0 publications

Thermal stability of glued wood joints measured by shear tests

Thermal stability of glued wood joints measured by shear tests

Structure–property relationships in one‐component polyurethane adhesives for wood: Sensitivity to low moisture content

Thermal Stability of Wood‐Wood and Wood‐FRP Bonding with Polyurethane and Epoxy Adhesives

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