Compact C-band Wilkinson Power Divider in Empty Substrate Integrated Coaxial Line

Merello, Jose M.; Nova, Vicente; Bachiller, C.; Boria, Vicente E.

doi:10.23919/eumc50147.2022.9784200

Cited by 2 publications

(4 citation statements)

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“…The microstrip-based solutions [7], [35], as reported, offers superior directivity; however, it necessitates the use of lumped elements or complex structures, resulting in a more intricate fabrication that becomes increasingly challenging at higher frequencies. Furthermore, the same concept of incorporating lumped elements can be applied to the directional coupler, as reported in [24] with a Wilkinson divider.…”

Section: Analysis and Discussion Of Resultsmentioning

confidence: 99%

“…Additionally, ESICL exhibits very low transmission and radiation losses while maintaining the cost-efficiency of planar technologies. Thanks to these exceptional advantages, several highperformance components have been developed, including filters [20]- [22], transitions to grounded coplanar and mi-crostrip lines [19], [23], power dividers [24], [25], and circulators [26]. However, no directional couplers have been designed before in this novel technology.…”

Section: Esicl a Transversal Section Designmentioning

confidence: 99%

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High-Directivity and Low-Loss Directional Couplers Based on Empty Substrate Integrated Coaxial Line Technology

Herraiz,

Esteban,

Herraiz

et al. 2024

IEEE Access

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High-directivity and low-loss directional couplers, based on Empty Substrate Integrated Coaxial Line (ESICL) technology, are presented in this article. The proposed coupled line direcional couplers, are based on combination of a high-isolation section, a tapering transition based on splines between the access lines and high-isolation sections, reduced-width coupled lines, and inclined arms. The design evolution has justified the combination and precise adjustment of these elements, proving to be a solution for enhancing directivity, reducing return losses, and attaining a more stable coupling coefficient. The use of the ESICL technology exhibits significant promise in terms of electrical performance, bandwidth, seamless integration with other planar circuits, and manufacturing simplicity. For comparison purposes, two directional couplers, with the same coupling coefficient but different operation frequencies, have been designed and manufactured. Additionally, a microstrip coupler has been designed and manufactured for comparison. The simulated and measured results clearly indicate that ESICL directional couplers outperform their microstrip counterparts in terms of losses and directivity, without the need for additional lumped elements or complex geometries.INDEX TERMS Empty substrate integrated coaxial line, directional couplers, transition, substrate integrated circuit, tapering structure, high directivity I. INTRODUCTIONT HE operating frequency of the satellite communication industry reveals a growing trend, moving towards the Ku, K, and Ka frequency bands [1]. This interest arises from the new communication systems requirements, particularly for emerging satellite communication systems based on small satellites, picosatellites, or nanosatellites, which demand higher bandwidth and throughput levels. This technological trend, while unable to entirely replace conventional satellite systems based on large satellites, introduces new paradigms in the development of novel and compact technological solutions. Consequently, this presents a significant challenge for microwave engineers, as they must develop passive components and equipment, such as filters, diplexers, antennas, and others, that strike a balance between electrical performance requirements, volume, weight, and manufacturing cost.Conventional communication satellite systems usually employ a payload implemented with waveguide technology, at least for the output stage. These components offer highquality electrical performance, high power-handling capabilities, and mechanical robustness [2]. However, they have significant drawbacks, including being bulky, heavy, expensive, and challenges while integrating other technologies. As an alternative, planar technologies, such as microstrip, coplanar,

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Section: Analysis and Discussion Of Resultsmentioning

confidence: 99%

Section: Esicl a Transversal Section Designmentioning

confidence: 99%

High-Directivity and Low-Loss Directional Couplers Based on Empty Substrate Integrated Coaxial Line Technology

Herraiz,

Esteban,

Herraiz

et al. 2024

IEEE Access

Self Cite

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“…Por otro lado, las soluciones basadas en microstrip [187,196], según se constata, ofrecen una directividad superior; sin embargo, requieren el uso de elementos concentrados o estructuras complejas, lo que resulta en una fabricación más compleja y que se vuelve cada vez más desafiante a frecuencias más altas. Además, el mismo concepto de incorporar elementos concentrados se puede aplicar al acoplador direccional, como se constata en [83] con un divisor Wilkinson.…”

Section: Fabricación Y Medida De Resultadosunclassified

“…En [43] se presenta un divisor en AFSIW con forma de T (ver Figura 2.15(a)), mientras que en [81,82] este divisor es mejorado añadiendo elementos resistivos. Respecto a soluciones implementada en ESICL, en [30], se presenta un divisor en T en plano del substrato, que posteriormente se mejora con un divisor Wilkinson [83].…”

Section: Divisoresunclassified

Antenas y componentes de microondas para satélites de dimensiones reducidas utilizando tecnologías vacías integradas en substrato

Herraiz Zanón

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En els darrers anys, s'ha observat un creixement exponencial en els nous sistemes de comunicació, entre els quals destaquen les comunicacions sense fils i espacials. Aquest fenomen ha generat un increment significatiu en els requisits dels sistemes de radiofreqüència. Aquest augment no només es refereix a la resposta elèctrica d'aquests sistemes, sinó també a altres paràmetres d'importància, com ara el pes, el cost, el volum i la integrabilitat amb altres tecnologies. Amb la finalitat de complir amb aquests requisits emergents, els circuits integrats en substrat, específicament els anomenats Circuits Integrats en Substrat Buit (ESiC), es presenten com una solució altament prometedora. Aquests circuits són reconeguts pel seu baix cost, lleugeresa i facilitat d'integració, alhora que preserven la seva eficàcia en termes de resposta elèctrica. La principal avantatge d'aquesta tecnologia radica en la capacitat d'incorporar tant components actius com passius, així com antenes, utilitzant el mateix substrat o combinant-ne diversos mitjançant processos de fabricació planar estàndard. La naturalesa buida d'aquests circuits possibilita la implementació de components d'alt rendiment sense comprometre les característiques prèvies.En aquest context, la present tesi doctoral es proposa com a objectiu central la investigació, disseny, desenvolupament i fabricació d'antenes i nous components de microones utilitzant tecnologies buides integrades en substrat, amb un enfocament en aplicacions per a satèl•lits de dimensions reduïdes. La tesi abordarà l'exploració de nous components de microones comuns en les càrregues útils de satèl•lits, com ara filtres, transicions entre tecnologies planars, divisors, entre altres, així com antenes, tant com a elements individuals com en agrupacions. Aquestes investigacions es duran a terme en el marc de les esmentades tecnologies emergents, amb la finalitat d'assolir un grau de miniaturització, dispositius altament eficients i de baix perfil, mantenint les seves característiques essencials i obtenint respostes millorades en comparació amb solucions prèviament conegudes. La combinació global dels dispositius i antenes proposats en la tesi doctoral obre noves possibilitats en les tecnologies buides integrades en substrat, contribuint potencialment a millorar la capacitat, robustesa i compacitat dels sistemes de comunicació emergents.

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Compact C-band Wilkinson Power Divider in Empty Substrate Integrated Coaxial Line

Cited by 2 publications

References 4 publications

High-Directivity and Low-Loss Directional Couplers Based on Empty Substrate Integrated Coaxial Line Technology

High-Directivity and Low-Loss Directional Couplers Based on Empty Substrate Integrated Coaxial Line Technology

Antenas y componentes de microondas para satélites de dimensiones reducidas utilizando tecnologías vacías integradas en substrato

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