Cold spraying for power electronics: Deposition of thick topologically patterned copper layers on ceramics

Косарев, В. Ф.; Клинков, С. В.; Melamed, B. M.; Nepochatov, Yu. K.; Ryashin, N. S.; Shikalov, V. S.

doi:10.1063/1.5065141

Cited by 16 publications

(4 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Field-emission SEM (FESEM; Zeiss Supra 55 equipped with an Oxford Nordlys EBSD detector, Jena, Germany) was used to obtain secondary electron images and EBSD data. The scan step sizes of 15 or 30 nm were used for EBSD measurements, and the electron beam conditions of Coatings 2022, 12, 1197 4 of 14 20 kV and 10 nA were applied for the FESEM-based analysis. The cross-section specimens for the EBSD analysis were cut from cold-sprayed Cu-coated AA6061 substrates and mounted in KonductoMet thermosetting resin.…”

Section: Microstructure Analysismentioning

confidence: 99%

“…Commercial Cu feedstocks are commonly fabricated through electrolysis (EP) and atomization. Cold-sprayed Cu coatings have potential applications in power electronics [20] and pin fin array heat sinks [21]. In our previous study, three commercially available Cu feedstocks, fabricated through EP, gas-assisted water atomization (WA), and inert gas atomization (GA) processes, were characterized and cold sprayed as coatings.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Influence of Powder Plasticity on Bonding Strength of Cold-Sprayed Copper Coating

Wei

Chou²,

Fung

et al. 2022

Coatings

View full text Add to dashboard Cite

When cold spraying is performed at a velocity equivalent to or greater than a specific material-dependent critical velocity, powders suffer intensive plastic deformation and localized heating of interacting surfaces. The thermomechanical reaction of the sprayed powder upon impacting the substrate material triggers thermally dependent metallurgical bonding and/or mechanical interlocking mechanisms. In this study, three Cu feedstocks, fabricated through electrolysis (EP), gas-assisted water atomization (WA), and inert gas atomization (GA), were characterized and annealed before cold spraying. The electron back-scattered diffraction technique was used to analyze the grain structure and plastic microstrain within the powders and coatings. The plastic microstrains that originally existed in the Cu powders were released after 30 min of annealing at 500 °C. The influence of plastic deformation behavior (associated with the grain structure and plastic microstrain of powder feedstocks) on the bonding strength of the cold-sprayed Cu coatings on AA6061 aluminum alloy substrates was examined. The results indicate that EP powder with an asymmetric dendrite morphology was not conducive to the intensive plastic deformation that may cause recrystallized twin grains to form after cold spraying. Furthermore, the homogeneous microstructure of the spherical Cu feedstocks, which may be induced by strain release as recrystallized twin grains and low-angle boundary grain growth through annealing, caused the cold-sprayed Cu coating to have high ductility and low hardness. The findings reveal the low strain hardening and residual stress in the cold-sprayed coating—characteristics regarded as providing key advantages for the bonding strength of the coating.

show abstract

Section: Microstructure Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Influence of Powder Plasticity on Bonding Strength of Cold-Sprayed Copper Coating

Wei

Chou²,

Fung

et al. 2022

Coatings

View full text Add to dashboard Cite

show abstract

“…[2][3][4][5]. This spraying process also allows deposition onto erodible materials such as polymers, composites and ceramics [6,7]. In CS, particles are accelerated by a supersonic flow of nitrogen, helium, or air up to 500-1000 m/s while their temperature remains below the melting point.…”

Section: Introductionmentioning

confidence: 99%

Numerical Study on Particle Behavior and Deposition Accuracy in Cold Spray Additive Manufacturing

Garmeh

Jadidi

2022

Coatings

View full text Add to dashboard Cite

Cold Spray additive manufacturing (CSAM) is an emerging technique to fabricate freestanding objects by depositing solid-state layers of materials. Thanks to its remarkable deposition rate and maneuverability, it can be tailored to manufacturing intricate geometries in aerospace industries. In comparison to other additive manufacturing techniques, it is the processing speed, solid-state deposition, and the cost that make CSAM unique. In this study, CSAM process was modeled for a system comprised of a high-pressure cold spray gun with axial powder injection. To represent the flow structure around the already built objects and the deposited layers of CSAM, three walls with different profiles are placed on a flat substrate. In this work, the gas-particle behaviors are studied at the vicinity of these non-axisymmetric objects that can be generalized to more complex geometries and the applications of CSAM. The model is 3D and aluminum and copper powders were used for the feedstock. The particles’ conditions upon impact, such as particles’ footprint and normal impact velocities are studied. The numerical results show that the deviation of particles which is caused by the supersonic flow inside the nozzle and the shock waves outside the nozzle defines the accuracy of the deposition. Furthermore, the results manifest the particle’s material and size have a significant influence on the acquired velocities and trajectories of the particles, and consequently on the resolution of the process. It is found that the profile of the deposited layers has some effects on the gas flow near the substrate which plays a role in the dispersion of fine particles.

show abstract

“…In our previous study, it was found that the deposition of pure copper coatings on ceramic substrates was difficult due to the delamination at the interface. On the other hand, the deposition of an aluminum coating on ceramic substrates is relatively easy [12]. Previous studies have shown that composite powders can be used to solve many problems in the LPCS process [13,14,15] while laser surface texturing can improve mechanical interlocking, adhesion strength and deposition efficiency [16,17].…”

Section: Introductionmentioning

confidence: 99%

Development of Cu Coating on Ceramic Substrates by Low Pressure Cold Spray and its Deposition Mechanism Analysis

Ichikawa

Ogawa

2021

MSF

View full text Add to dashboard Cite

Cold spray (CS) is a solid-state deposition technique of micron-sized metallic powder in an ultra-high velocity gas using a de Laval nozzle. CS is a unique deposition technique due to its use of relatively lower gas temperatures in comparison to other thermal processes. Consequently, high-temperature oxidation and phase transformations of deposited powders are largely restricted while the operating cost of CS is much lower than that of other thermal processes. Generally, the low pressure cold spray (LPCS) technique is used for the deposition of metallic powders on metallic substrates, while only a few studies of metallic particle deposition on ceramic substrates have been conducted, and it was found that the deposition of metallic powders on ceramic substrates was quite difficult. In this study, improved LPCS deposition of copper coatings on zirconia substrates was investigated. It is known that deposition of a metallic powder on a ceramic substrate is difficult due to the differences in material bonding and several properties of the two materials. These difficulties in LPCS deposition were solved using three different approaches, namely 1) use of copper and aluminum composite powders and 2) laser pre-treatment and 3) laser texturing of zirconia substrates. It was found that pure copper powder coatings on the as-received and various treated substrates were delaminated in the interface as expected. However, the deposition was improved for all substrates by using the copper and aluminum composite powder. While the laser pre-treated substrate was not effective for the deposition of the copper and aluminum composite powder, thick coatings were obtained for the deposition on the laser pre-treated with heat treatment substrate and the laser-textured substrate.

show abstract

Cold spraying for power electronics: Deposition of thick topologically patterned copper layers on ceramics

Cited by 16 publications

References 7 publications

Influence of Powder Plasticity on Bonding Strength of Cold-Sprayed Copper Coating

Influence of Powder Plasticity on Bonding Strength of Cold-Sprayed Copper Coating

Numerical Study on Particle Behavior and Deposition Accuracy in Cold Spray Additive Manufacturing

Development of Cu Coating on Ceramic Substrates by Low Pressure Cold Spray and its Deposition Mechanism Analysis

Contact Info

Product

Resources

About