Cohesive zone models for the shear creep life assessment of bonded joints

Neto, Ranulfo Martins Carneiro; Sales, F. de Medeiros; Sampaio, Eduardo Martins; Akhavan‐Safar, A.; Assis, Joaquim T. de; Silva, L. F. M. da

doi:10.1007/s11043-022-09548-x

Cited by 6 publications

(4 citation statements)

References 24 publications

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“…Recently, several studies have presented creep analysis of bonded joints in mode II using CZMs. [96][97][98] Hadjazi et al 96 investigated the long-term behaviour of interfacial shear stresses using a bi-linear cohesive zone model aiming to unify the debonding initiation and growth with time increments. Carneiro Neto et al 97,98 developed a user material subroutine in Abaqus to predict the creep behaviour of ENF samples for a wide range of load levels and creep times.…”

Section: -98mentioning

confidence: 99%

“…The numerical creep curves of the ENF samples obtained by the customised CZM achieved good agreement with the experimental results for both works. 97,98 The described model is limited to predicting primary and secondary creep of ENF samples. Further work using CZM models are needed, especially for loading in mixed mode, which can generate a more comprehensive model.…”

Section: -98mentioning

confidence: 99%

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Creep behaviour of adhesively bonded joints: A comprehensive review

Carneiro Neto,

Akhavan-Safar,

Sampaio

et al. 2024

Proceedings of the Institution of Mechanical Engineers, Part L:

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This review paper provides an exploration of various facets of creep behaviour in adhesives and adhesive joints, encompassing experimental procedures, prediction models, influential parameters and strategies to enhance resistance. The discussion extends to the interplay between fatigue and creep, emphasising recent advances over the last two decades. While avoiding redundancy with prior work on temperature and moisture degradation, the paper articulates connections between topics for a better understanding. A critical examination of load levels reveals that small variations significantly impact the creep life of adhesive joints, particularly prominent with epoxy adhesives. The adhesive type, joint geometry and substrate material are scrutinised, revealing distinct impacts on creep behaviour. The study underscores the critical role of adhesive thickness and overlap length, emphasising their relevance in determining the time to failure in bonded joints under creep conditions. Notably, the substrate material’s role is highlighted. As the review delves into unexplored dimensions, it calls for further research to bridge existing gaps and refine our understanding of tertiary creep and time until failure.

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Section: -98mentioning

confidence: 99%

Section: -98mentioning

confidence: 99%

Creep behaviour of adhesively bonded joints: A comprehensive review

Carneiro Neto,

Akhavan-Safar,

Sampaio

et al. 2024

Proceedings of the Institution of Mechanical Engineers, Part L:

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“…Therefore, several researchers have adopted numerical simulation methods to characterize the mechanical properties of interfaces. The cohesive zone modeling (CZM) method proposed by Dugdale [ 8 ] and Barenblatt [ 9 ] is the most popular method and has been widely used to address interface problems involving different structures [ 10 , 11 , 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Using Machine Learning and Finite Element Analysis to Extract Traction-Separation Relations at Bonding Wire Interfaces of Insulated Gate Bipolar Transistor Modules

Zhao,

An,

Wang

et al. 2024

Materials

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For insulated gate bipolar transistor (IGBT) modules using wire bonding as the interconnection method, the main failure mechanism is cracking of the bonded interface. Studying the mechanical properties of the bonded interface is crucial for assessing the reliability of IGBT modules. In this paper, first, shear tests are conducted on the bonded interface to test the bonded interface’s strength. Then, finite element–cohesive zone modeling (FE-CZM) is established to describe the mechanical behavior of the bonded interface. A novel machine learning (ML) architecture integrating a convolutional neural network (CNN) and a long short-term memory (LSTM) network is used to identify the shape and parameters of the traction separation law (TSL) of the FE-CZM model accurately and efficiently. The CNN-LSTM architecture not only has excellent feature extraction and sequence-data-processing abilities but can also effectively address the long-term dependency problem. A total of 1800 sets of datasets are obtained based on numerical computations, and the CNN-LSTM architecture is trained with load–displacement (F–δ) curves as input parameters and TSL shapes and parameters as output parameters. The results show that the error rate of the model for TSL shape prediction is only 0.186%. The performance metric’s mean absolute percentage error (MAPE) is less than 3.5044% for all the predictions of the TSL parameters. Compared with separate CNN and LSTM architectures, the proposed CNN-LSTM-architecture approach exhibits obvious advantages in recognizing TSL shapes and parameters. A combination of the FE-CZM and ML methods in this paper provides a promising and effective solution for identifying the mechanical parameters of the bonded interfaces of IGBT modules.

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“…By incorporating CZMs into FE simulations, it becomes possible to capture the complex behavior of delamination, including crack initiation, propagation, and interaction with other structural features. In the literature, CZM has been implemented to simulate the many kinds of interfaces, including some applications related to polymers [ 8 ] and bonded joints [ 9 , 10 ]. Regarding power electronics applications, CZM has been used in copper-to-resin adhesion [ 11 ], solder joint interface delamination [ 12 ], the bonding/debonding behavior of bond pad structures [ 13 ], the debonding process of stiff film/compliant substrate systems [ 14 ], the failure mechanisms of stretchable electronics [ 15 ], the solder layer and semiconductor chip interface [ 16 ], and thermal fatigue [ 17 ], among others.…”

Section: Introductionmentioning

confidence: 99%

Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages

Mirone,

Barbagallo,

Bua

et al. 2023

Materials

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Delamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomechanical loads. The finite element (FE) simulation of this phenomenon is very challenging for the identification of the appropriate modeling tools and their subsequent calibration. In this study, we present an advanced FE modeling approach for delamination, together with fundamental guidelines to calibrate it. Considering a reference power electronics package subjected to thermomechanical loads, FE simulations with a global–local approach are proposed, also including the implementation of a bi-linear cohesive zone model (CZM) to simulate the complex interfacial behavior between the different layers of the package. A parametric study and sensitivity analysis is presented, exploring the effects of individual CZM variables on the delamination behavior, identifying the most crucial ones and accurately describing their underlying functioning. Then, this work gives valuable insights and guidelines related to advanced and aware FE simulations of delamination in power electronics packages, useful for the design and optimization of these devices to mitigate their vulnerability to thermomechanical loads.

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Cohesive zone models for the shear creep life assessment of bonded joints

Cited by 6 publications

References 24 publications

Creep behaviour of adhesively bonded joints: A comprehensive review

Creep behaviour of adhesively bonded joints: A comprehensive review

Using Machine Learning and Finite Element Analysis to Extract Traction-Separation Relations at Bonding Wire Interfaces of Insulated Gate Bipolar Transistor Modules

Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages

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