Codeposition of ultrafine WC particles in Ni matrix composite electrocoatings

Stroumbouli, M.; Gyftou, P.; Pavlatou, Evangelia A.; Spyrellis, N.

doi:10.1016/j.surfcoat.2004.06.034

Cited by 145 publications

(73 citation statements)

References 33 publications

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“…Electrodeposition for long duration (at all current density) leads to "dendrite like" branched outgrowth. Similar "dendrite like" growth has been reported earlier by Pavlatou et.al [37]. Fig.…”

Section: Codeposition Of Wc Particles With Nickelsupporting

confidence: 88%

“…However, in the case of non metallic carbide (i.e. WC) the codeposition of the particles modifies the adsorption-desorption phenomena occurring on the metallic surface that results in change of the catholyte composition [37]. This alteration exerts a much more intense inhibition to the Ni crystal growth, which leads to the grain refinement.…”

Section: Surface Morphological Studiesmentioning

confidence: 99%

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Electrocodeposition and Characterization of Ni-WC Composite Coating From Non − Aqueous Bath

Singh¹,

Tripathi²,

Singh

2013

IJMSA

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Abstract:Composite coating of tungsten carbide (WC) in the matrix of nickel has been achieved by direct current (DC) electrodeposition technique using a non aqueous bath. The deposition parameters such as current density, bath temperature, and stirring rate were maintained at constant levels for all the coating configurations. The composition of the coating and its microstructure were studied using energy dispersive x-ray spectroscopy, uv-vis spectrophotometry and x-ray diffraction, respectively. Surface morphology of the coatings was studied by scanning electron microscopy (SEM and TEM). Effect of heat treatment on the deposits microstructures and microhardness was also investigated. The Ni-WC composites, prepared at optimum conditions, exhibited improved mechanical properties in comparison to pure nickel electrodeposits.

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Section: Codeposition Of Wc Particles With Nickelsupporting

confidence: 88%

Section: Surface Morphological Studiesmentioning

confidence: 99%

Electrocodeposition and Characterization of Ni-WC Composite Coating From Non − Aqueous Bath

Singh¹,

Tripathi²,

Singh

2013

IJMSA

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“…A variety of nanosized particles, ranging from 4 nm to 800 nm diameters, have been successfully incorporated into metallic electrodeposits (Low et al, 2006). These include oxides such as Al 2 O 3 , ZrO 2 , TiO 2 and Cr 2 O 3 or carbides like SiC, WC, TiC or nitrides like Si 3 N 4 (Bahrololoom & Sani 2005;Jung et al, 2009;Srivastava et al, 2010;Krishnaveni et al, 2008;Stroumbouli et al, 2005;Gay et al, 2001).The metals mostly used are copper and nickel (Low el al., 2006) however other metals like zinc, silver and, alloys have been used (Gomes et al, 2005;Gay et al, 2001;Tulio & Carlos 2009;Muller et al, 2002;Tian & Cheng, 2007). The most studied system has been the Ni-SiC due to its potential technological applications (Low et al, 2006;Hovestad & Janssen 1995;Zimmermann et al, 2002;Hou et al, 2002;Garcia et al 2001;Gyftou et al, 2005;Lekka et al, 2005).…”

Section: General Aspectsmentioning

confidence: 99%

Electrodeposition of Metal Matrix Nanocomposites: Improvement of the Chemical Characterization Techniques

Gomes¹,

Pereira²,

Pereiro³

2011

Advances in Nanocomposites - Synthesis, Characterization and Industrial Applications

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“…[60] The dependence of particle content in the deposit and consequently on the microstructure and surface properties has been studied by many authors. [78][79][80] In all studies, the volume fraction of the incorporated particles in the coatings with increase in the particle concentration in the plating bath up to an optimum value and decreases again. The particle shape affects the adsorption of the particles on the cathode by varying the charge on the particle surface and the suspension stability.…”

Section: Particle Concentration and Sizementioning

confidence: 88%

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Sharma¹,

Das²,

Das³

2016

Electrodeposition of Composite Materials

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This chapter provides a detailed overview of the various Sn-based composites solders reinforced with ceramic nanoparticles. These solders are lead free in nature and are produced by various process like powder metallurgy, ball milling, casting as well as simple and economic pulse co-electrodeposition technique. In this chapter, various electrodeposited composite solders, their synthesis, characterization, and evaluation of various properties for microelectronic packaging applications, such as microstructure, microhardness, density and porosity, wear and friction, electrochemical corrosion, melting point, electrical resistivity, and residual stress of the monolithic Sn-based and (nano)composite solders have been presented and discussed. This chapter is divided into the following sections: such as introduction to microelectronic packaging, synthesis routes for solders and composites, various nanoreinforcement, and the mechanism of incorporation in solder matrix, the pulse co-electrodeposition technique, the various factors affecting composite deposition, and the improved properties of composite solders over monolithic solders for microelectronic packaging applications are also summarized here.

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Codeposition of ultrafine WC particles in Ni matrix composite electrocoatings

Cited by 145 publications

References 33 publications

Electrocodeposition and Characterization of Ni-WC Composite Coating From Non − Aqueous Bath

Electrocodeposition and Characterization of Ni-WC Composite Coating From Non − Aqueous Bath

Electrodeposition of Metal Matrix Nanocomposites: Improvement of the Chemical Characterization Techniques

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

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