CMP Method and Practice

Cadien, Ken; Nolan, L.

doi:10.1016/b978-1-4377-7873-1.00007-3

Cited by 6 publications

(5 citation statements)

References 48 publications

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“…However, the immensely complex, miniaturized architectures of the sub-10 nm technology node have substantially compounded the chemical designs of CMP slurries. 1,2 These slurries typically contain multiple chemical additives, including unconventional complexing agents, corrosion inhibitors, strong oxidizers, and stabilizers that tend to remain as persistent residues on CMP processed surfaces. If not effectively removed by PCMPC, these residues adversely affect device performance.…”

mentioning

confidence: 99%

Editors' Choice—In Situ Electrochemical Evaluation of Post-CMP Cleaning Reactions for Cobalt and Copper Films under Brushing Conditions

Johnson¹,

Roy²

2019

ECS J. Solid State Sci. Technol.

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The sub-10 nm technology node has introduced significant chemical complexities in the associated processing steps of chemical mechanical planarization (CMP), and this has correspondingly convoluted the post-CMP cleaning (PCMPC) protocols. Focusing on selected cleaning chemistries, the present work demonstrates an in-situ tribo-electrochemical approach to developing fundamental knowledge of the PCMPC mechanisms for such systems. As model samples, the experiments use cobalt and copper thin films, deposited on wafer coupons, and treated in an alkaline CMP solution of acetate, H2O2 and benzotriazole. These samples are subsequently studied in an alkaline PCMPC solution of oxalic acid, designed for cleaning both Co and Cu. The surface cleaning characteristics of the metals are assessed by tribo-electrochemical measurements in the presence of mechanical brushing with a commercial rotary brush for PCMPC. The tribo-electrochemical parameters of the PCMPC-active brushed wafer regions are extracted from the recorded data to determine the cleaning mechanisms. Open circuit potential and voltammetric measurements indicate that oxalate ions serve to remove the CMP residues, Co(OH)2 and Cu-oxides from Co and Cu surfaces, respectively, in the forms of oxalate complexes. The residue removal efficiencies, measured by ex-situ impedance spectroscopy, are found in the 85–89% range for both Co and C

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mentioning

confidence: 99%

Editors' Choice—In Situ Electrochemical Evaluation of Post-CMP Cleaning Reactions for Cobalt and Copper Films under Brushing Conditions

Johnson¹,

Roy²

2019

ECS J. Solid State Sci. Technol.

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“… Isopoda , Asellota , Janiroidea , Paramunnidae (in part): A Austrosignum latum (after Just and Wilson (2021) B Boreosignum sp. A (after Cadien 2008 ) C Munnogonium erratum , C1 male pereopod 2 (after Wilson 1997 ) D Munnogonium tillerae D1 male pereopod 2 (after Just and Wilson (2021) . Pleurocopidae : E Pleurocope floridensis (Caribbean species = representative for Pleurocope sp.…”

Section: Resultsmentioning

confidence: 99%

“…Body length < 1 mm. See Cadien (2008 : voucher sheet for Boreosignum sp. IS1 available from SCAMIT Toolbox at https://www.scamit.org ; specimens examined 5 April 2008, D. B. Cadien), Maloney et al (2008) , and SCAMIT (2012 – 2021 ).…”

Section: Resultsmentioning

confidence: 99%

Review and guide to the isopods (Crustacea, Isopoda) of littoral and sublittoral marine habitats in the Southern California Bight

Stebbins¹,

Wetzer²

2023

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The isopod crustaceans reported from or expected to occur in littoral and sublittoral marine habitats of the Southern California Bight (SCB) in the northeastern Pacific Ocean are reviewed. A total of 190 species, representing 105 genera in 42 families and six suborders are covered. Approximately 84% of these isopods represent described species with the remaining 16% comprising well-documented “provisional” but undescribed species. Cymothoida and Asellota are the most diverse of the six suborders, accounting for ca. 36% and 29% of the species, respectively. Valvifera and Sphaeromatidea are the next most speciose suborders with between 13–15% of the species each, while the suborder Limnorioidea represents fewer than 2% of the SCB isopod fauna. Finally, the mostly terrestrial suborder Oniscidea accounts for ca. 5% of the species treated herein, each which occurs at or above the high tide mark in intertidal habitats. A key to the suborders and superfamilies is presented followed by nine keys to the SCB species within each of the resultant groups. Figures are provided for most species. Bathymetric range, geographic distribution, type locality, habitat, body size, and a comprehensive list of references are included for most species.

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“…After this step, a Cu seed layer is also deposited with the same method, followed by electrochemical plating (ECP) of Cu [57,58]. After Cu deposition, chemical mechanical polishing (CMP) was performed on top to grind down the extra portion of Cu and expose the porous dielectric layer [59,60]. An NH 3 or H 2 plasma clean is performed to remove copper oxides prior to the deposition of the cap layer for adhesion improvement [61,62].…”

Section: Dual-damascene Process and Plasma-induced Damagementioning

confidence: 99%

The Evolution of Organosilicon Precursors for Low-k Interlayer Dielectric Fabrication Driven by Integration Challenges

et al. 2021

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Since the application of silicon materials in electronic devices in the 1950s, microprocessors are continuously getting smaller, faster, smarter, and larger in data storage capacity. One important factor that makes progress possible is decreasing the dielectric constant of the insulating layer within the integrated circuit (IC). Nevertheless, the evolution of interlayer dielectrics (ILDs) is not driven by a single factor. At first, the objective was to reduce the dielectric constant (k). Reduction of the dielectric constant of a material can be accomplished by selecting chemical bonds with low polarizability and introducing porosity. Moving from silicon dioxide, silsesquioxane-based materials, and silica-based materials to porous silica materials, the industry has been able to reduce the ILDs’ dielectric constant from 4.5 to as low as 1.5. However, porous ILDs are mechanically weak, thermally unstable, and poorly compatible with other materials, which gives them the tendency to absorb chemicals, moisture, etc. All these features create many challenges for the integration of IC during the dual-damascene process, with plasma-induced damage (PID) being the most devastating one. Since the discovery of porous materials, the industry has shifted its focus from decreasing ILDs’ dielectric constant to overcoming these integration challenges. More supplementary precursors (such as Si-C-Si structured compounds), deposition processes (such as NH3 plasma treatment), and post porosity plasma protection treatment (P4) were invented to solve integration-related challenges. Herein, we present the evolution of interlayer dielectric materials driven by the following three aspects, classification of dielectric materials, deposition methods, and key issues encountered and solved during the integration phase. We aim to provide a brief overview of the development of low-k dielectric materials over the past few decades.

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CMP Method and Practice

Cited by 6 publications

References 48 publications

Editors' Choice—In Situ Electrochemical Evaluation of Post-CMP Cleaning Reactions for Cobalt and Copper Films under Brushing Conditions

Editors' Choice—In Situ Electrochemical Evaluation of Post-CMP Cleaning Reactions for Cobalt and Copper Films under Brushing Conditions

Review and guide to the isopods (Crustacea, Isopoda) of littoral and sublittoral marine habitats in the Southern California Bight

The Evolution of Organosilicon Precursors for Low-k Interlayer Dielectric Fabrication Driven by Integration Challenges

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CMP Method and Practice

Cited by 6 publications

References 48 publications

Editors' Choice—In Situ Electrochemical Evaluation of Post-CMP Cleaning Reactions for Cobalt and Copper Films under Brushing Conditions

Editors' Choice—In Situ Electrochemical Evaluation of Post-CMP Cleaning Reactions for Cobalt and Copper Films under Brushing Conditions

﻿Review and guide to the isopods (Crustacea, Isopoda) of littoral and sublittoral marine habitats in the Southern California Bight

The Evolution of Organosilicon Precursors for Low-k Interlayer Dielectric Fabrication Driven by Integration Challenges

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Product

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About

Review and guide to the isopods (Crustacea, Isopoda) of littoral and sublittoral marine habitats in the Southern California Bight