Chemistry in Microelectronics 2013
DOI: 10.1002/9781118578070.ch1
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Chemistry in the “Front End of the Line” (FEOL)

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“…In further studies disilane was used as a dopant source to exceed the doping level of 10 19 cm −3 suit− able for future applications in QCLs. Compared to silane, disilane decomposes at lower temperatures due to the weaker Si−Si bond (226 kJ/mol) in Si 2 H 6 than the Si−H bond in SiH 4 (318 kJ/mol) [10] what gives a higher doping efficiency. The influence of IV/III ratio on the electron concentration in InGaAs epilayers for disilane and the lowest growth rate (1.08 μm/h) is presented in Fig.…”
mentioning
confidence: 99%
“…In further studies disilane was used as a dopant source to exceed the doping level of 10 19 cm −3 suit− able for future applications in QCLs. Compared to silane, disilane decomposes at lower temperatures due to the weaker Si−Si bond (226 kJ/mol) in Si 2 H 6 than the Si−H bond in SiH 4 (318 kJ/mol) [10] what gives a higher doping efficiency. The influence of IV/III ratio on the electron concentration in InGaAs epilayers for disilane and the lowest growth rate (1.08 μm/h) is presented in Fig.…”
mentioning
confidence: 99%