2010
DOI: 10.1016/j.micron.2009.10.006
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Characterization of the interphase in an aluminium/epoxy joint by using controlled pressure scanning electron microscopy coupled with an energy dispersive X-ray spectrometer

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Cited by 7 publications
(3 citation statements)
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“…the art, the epoxy component of the mixture did not seem to react with metallic surfaces. XPS data also pointed out that the dissolution process of the metal surface upon contact with the amine strongly depended on the (hydr)oxidation of the surface [24 28], leading to direct evidence of metal compound (its state is not evidenced) within the adhesive layer [15,19]. The interphase formation however depends on many other parameters, such as the surface treatment [14], the nature of the amine (hardener) and the curing cycle [11 13], the thickness of the coating and its environment (thin coatings versus thick adhesive joint) [16], or the viscosity of the pre polymer mixture [28,29].…”
Section: Mixing Calorimetrymentioning
confidence: 99%
“…the art, the epoxy component of the mixture did not seem to react with metallic surfaces. XPS data also pointed out that the dissolution process of the metal surface upon contact with the amine strongly depended on the (hydr)oxidation of the surface [24 28], leading to direct evidence of metal compound (its state is not evidenced) within the adhesive layer [15,19]. The interphase formation however depends on many other parameters, such as the surface treatment [14], the nature of the amine (hardener) and the curing cycle [11 13], the thickness of the coating and its environment (thin coatings versus thick adhesive joint) [16], or the viscosity of the pre polymer mixture [28,29].…”
Section: Mixing Calorimetrymentioning
confidence: 99%
“…In the presence of metal substrates, however, the amine precursor was found to react with metal surfaces [4][5][6][7][8][9][10][11][12][13][14][15], leading to significant modifications in terms of degree of curing and glass transition temperature, T g . These modifications can in turn alter the expected behavior of the polymerized networks as well as their mechanical/thermal resistance over time and other properties upon use [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…These techniques allowed observing the formation of metal-amine surface complexes [17][18][19][20] as well as of chelates in solution [6][7][8][17][18][19]. This was associated with partial dissolution of the metal surface on contact with the amine [17][18][19][20][21], leading to the presence of the metal element in the adhesive layer [10,14]. A molecular dynamics (MD) study has been reported to investigate an epoxy-amine-copper system and its curing kinetics [22]; also, another MD study investigated the DGEBA/DETA polymerization at the vicinity of a generic surface [23].…”
Section: Introductionmentioning
confidence: 99%