1999
DOI: 10.1016/s0927-7765(99)00032-6
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Calculation of van der Waals interactions involving lipid vesicles

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Cited by 4 publications
(5 citation statements)
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“…Vesicles and bilayers have colloidal size dimensions, so interactions between them may be treated according to Derjaguin-Landau-Verwey-Overbeek (DLVO) theory, which involves van der Waals and electrostatic contributions [24,25]. Inclusion of hydration and steric contributions (i.e., extended-DLVO) has previously led to accurate predictions and verifications of experimental observations [26][27][28][29].…”
Section: Introductionmentioning
confidence: 99%
“…Vesicles and bilayers have colloidal size dimensions, so interactions between them may be treated according to Derjaguin-Landau-Verwey-Overbeek (DLVO) theory, which involves van der Waals and electrostatic contributions [24,25]. Inclusion of hydration and steric contributions (i.e., extended-DLVO) has previously led to accurate predictions and verifications of experimental observations [26][27][28][29].…”
Section: Introductionmentioning
confidence: 99%
“…Inspired by the recent calculation of van der Waals interactions involving lipid vesicles [13] we consider once again the symmetrical model (3.4) but with modified leftmost and rightmost half-spaces. For z > L/2 we write…”
Section: Van Der Waals Interactions Involving Lipid and Water Layersmentioning
confidence: 99%
“…This system when a = 0 has been studied in [13]. The dielectric permittivity of water and lipid DPPC (dipalmitoylphosphatidylcholine) are described in semiempirical approximation with formulae of the type [16]…”
Section: Appendix a The Contribution Of Te Modes To The Force Formula...mentioning
confidence: 99%
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“…Many researches have been investigated the particle adhesion on the surface. [5][6][7][8][9][10][11][12][13][14][15][16] Lee et al have shown that the calculation of the interaction force between a particle and a surface and the adhesion force measurement by atomic force microscopy (AFM) can be used to understand the adhesion and removal of particles on surface in post CMP cleaning process. 17) In this paper, the adhesion and removal of silica and alumina particles on surfaces has been investigated during wet processes at different pH values.…”
Section: Introductionmentioning
confidence: 99%