volume 34, issue 21, P1635-1642 1994
DOI: 10.1002/pen.760342109
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Abstract: Abstract By using an advanced epoxy resin of 22,500 weight average molecular weight two bimodal systems of 6300 weight average molecular weights were prepared. By altering the curing procedure normally used to cure epoxy resins and high molecular weight resins we have succeeded in minimizing the difficulty associated with preparing bimodal epoxy resin systems. The ultimate Tg of these bimodal systems is associated with the phase morphology and controlled by the curing conditions employed. For the completely p…

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