Bending reliability of printed conductors deposited on plastic foil with various silver pastes

Happonen, Tuomas; Ritvonen, Tapio; Korhonen, Pentti; Häkkinen, Juha; Fabritius, Tapio

doi:10.1007/s00170-015-7403-9

Cited by 20 publications

(11 citation statements)

References 15 publications

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“…For example, the effect of pn-junction heating during the powering and the effect of heat conduction on the foil could clarify many of the observed phenomena. That approach would enable the analysis the effect of environmental conditions on the lifetime of this type of products in various conditions to deepen the understanding of reliability of flexible, large area electronics [10][11][12].…”

Section: Discussionmentioning

confidence: 99%

Flexible Electronics Non-Destructive Uniformity Characterization by Synchronized Thermography

Remes

Latomaki

Fabritius

2019

2019 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

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Synchronized thermography (ST) is utilized in the characterization of a flexible hybrid electronics. ST is used for both in the analysis of the structural uniformity and electrical functionality. Flexible lighting foils combining conventionally manufactured light-emitting diode (LED) chips and current regulators with a printed wiring on polyethylene terephthalate (PET) substrate were used as test samples. The measurement results proves that ST measurement method is a feasible method for the uniformity and electrical functionality characterization of large-area printed thin films with conventional electronics. ST is an interesting option to be used as a measurement tool for online quality monitoring of hybrid electronics manufacturing.

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Section: Discussionmentioning

confidence: 99%

Flexible Electronics Non-Destructive Uniformity Characterization by Synchronized Thermography

Remes

Latomaki

Fabritius

2019

2019 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

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“…The SMF metal contact also exhibits excellent flexibility and good adhesion to the ETL because of its porous nature containing flexible polymer binder (Note S6). Furthermore, the final blade-coated SMFs result in the formation of an ETL that exhibits no visible cracks (Figure d).…”

Section: Resultsmentioning

confidence: 99%

High-Brightness Perovskite Light-Emitting Diodes Using a Printable Silver Microflake Contact

Payandeh

Ahmadi

Roghabadi

et al. 2020

ACS Appl. Mater. Interfaces

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Achieving efficient devices while maintaining a high fabrication yield is a key challenge in the fabrication of solution-processed, perovskite-based light-emitting diodes (PeLEDs). In this respect, pinholes in the solution-processed perovskite layers are a major obstacle. These are usually mitigated using organic electron-conducting planarization layers. However, these organic interlayers are unstable under applied bias in air and suffer from limited charge carrier mobility. In this work, we present a high brightness p–i–n PeLED based on a novel blade-coated silver microflake (SMF) rear electrode, which allows for a low-cost nanocrystalline ZnO inorganic electron-transporting layer to be used. This novel SMF contact is crucial for achieving high performance as it prevents the electrical shorting suffered when standard thermally evaporated silver rear contacts are used. The fabricated PeLEDs exhibit an excellent maximum luminance of 98,000 cd/m2, a maximum current efficiency of 22.3 cd/A, and a high external quantum efficiency of 4.6% under 5.9 V forward bias. The SMF rear contact can be printed and scaled at low cost to large areas and applied to flexible devices.

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“…According to Equation (9), if the substrate and material thicknesses are well chosen, the strain of the structures can be controlled for known bending radii. With the selection of suitable materials and from Equation (9) it can be seen that mainly the layer thicknesses and the bending radius rather dominate the strain [ 89 ]. However, if no strain is desired at all, then the structures should be encapsulated between two substrates, for example, the structures lie in the neutral plane.…”

Section: Mechanics Of Bendingmentioning

confidence: 99%

Bending Setups for Reliability Investigation of Flexible Electronics

et al. 2021

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Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.

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Bending reliability of printed conductors deposited on plastic foil with various silver pastes

Cited by 20 publications

References 15 publications

Flexible Electronics Non-Destructive Uniformity Characterization by Synchronized Thermography

Flexible Electronics Non-Destructive Uniformity Characterization by Synchronized Thermography

High-Brightness Perovskite Light-Emitting Diodes Using a Printable Silver Microflake Contact

Bending Setups for Reliability Investigation of Flexible Electronics

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