2011 19th International Euromicro Conference on Parallel, Distributed and Network-Based Processing 2011
DOI: 10.1109/pdp.2011.83
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Automatic Feedback Control of Shared Hybrid Caches in 3D Chip Multiprocessors

Abstract: 3D integration enables building caches from different types of technologies such as SRAM, Magnetic RAM (MRAM), DRAM, and Phase-change RAM (PRAM). Hybrid cache architectures (HCAs) have been proposed to take advantage of the benefits offered by these types of technologies. Employing this novel cache architecture to build shared caches in chip multiprocessors (CMPs) can lead to significant performance and power consumption improvements. In this paper, we focus on a 3D CMP design in which the shared last level L2… Show more

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Cited by 6 publications
(2 citation statements)
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References 38 publications
(43 reference statements)
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“…Several researchers discuss 3D stacking of NVM caches (e.g. [7,10,61,70,84]). As an example, Sun et al [61] propose fabricating STT-RAM caches and CMP logic as two separate dies and then stack them together in a vertical manner.…”
Section: Classification and Overviewmentioning
confidence: 99%
See 1 more Smart Citation
“…Several researchers discuss 3D stacking of NVM caches (e.g. [7,10,61,70,84]). As an example, Sun et al [61] propose fabricating STT-RAM caches and CMP logic as two separate dies and then stack them together in a vertical manner.…”
Section: Classification and Overviewmentioning
confidence: 99%
“…Sharifi et al [84] propose a cache partitioning approach for providing QoS to different programs in a chip multiprocessor, where the last level shared cache is designed as a hybrid SRAM -STTRAM cache. The SRAM region provides smaller capacity with fast access speed, while opposite is true for the STT-RAM region.…”
Section: Sram+sttram Hybrid Cachesmentioning
confidence: 99%