2018
DOI: 10.1016/j.yofte.2018.02.019
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Automated, high-throughput photonic packaging

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Cited by 41 publications
(21 citation statements)
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“…Thus, for the in-line hybrid waveguide, the pursuit of substantial reductions in switching time is now less urgent than optimizing the size, shape and volume of the VO 2 structure, as well as addressing the thermal management of the chip at high pump rates. Implementation of extant on-chip, in-plane optical pumping designs [35,36] and investigation of alternate optical-switching geometries such as resonant and interferometric configurations offer significant opportunities to make further progress toward practical implementation of a hybrid VO 2 :Si all-optical switch.…”
Section: Discussionmentioning
confidence: 99%
“…Thus, for the in-line hybrid waveguide, the pursuit of substantial reductions in switching time is now less urgent than optimizing the size, shape and volume of the VO 2 structure, as well as addressing the thermal management of the chip at high pump rates. Implementation of extant on-chip, in-plane optical pumping designs [35,36] and investigation of alternate optical-switching geometries such as resonant and interferometric configurations offer significant opportunities to make further progress toward practical implementation of a hybrid VO 2 :Si all-optical switch.…”
Section: Discussionmentioning
confidence: 99%
“…According to this basic and widely agreed principle of minimizing capital expenditures, earlier work that employs specialized fibers, dispersiontailored components or other fiber-optic bulk components [13,[21][22][23][24]43] will likely be associated to higher cost when compared with concepts that leverage photonic integrated circuit (PIC) technology that augments the opto-electronic RRH transceiver front-end with optically-enabled RF beamforming functions [12,14,[33][34][35][36][37][38][39][40][41]. Towards this second direction, the largest cost contribution of PIC-based solutions derives from assembly and packaging [47]. It is therefore essential to reduce the number of fiber ports and electrical pins.…”
Section: State-of-the-art In True-time Delays and Photonic-assisted Rf Beamformersmentioning
confidence: 99%
“…Mechanical flexibility allows flexible links to move and change shape to maximize the coupling efficiency, thereby relaxing the alignment tolerances. An example of a low-cost, high-volume approach based on flexible links consists of using lithographically defined alignment features that guide flexible waveguide ribbons into place …”
Section: Applicationsmentioning
confidence: 99%
“…An example of a lowcost, high-volume approach based on flexible links consists of using lithographically defined alignment features that guide flexible waveguide ribbons into place. 171 Photonic Tuning and Strain Sensing. Controlled mechanical deformation furnishes a uniquely advantageous approach for tuning photonic structures, as the large strain attainable in flexible photonic structures (in some cases exceeding 100%) enables extreme broadband tuning or reconfiguration between two drastically different optical states.…”
Section: ■ Applicationsmentioning
confidence: 99%