2021
DOI: 10.2478/msr-2021-0002
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Abstract: Glass as an alternative printed circuit board material and interposer has been investigated for use in the micro-electronics industry. Electroless copper plating is used to provide the conductive layer, but there is limited understanding of how the surface topography of the glass substrate affects the copper/glass bonding strength exhibited in the current literature. A laser ablation technique was used to prepare glass surfaces with micro-scale structured features in this study, and these features were charact… Show more

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