Abstract:Three-Dimensional Stacked Integrated Circuit (3D-SICs) based on Through-Silicon Vias (TSVs) provide a highdensity integration technology. However, integrating pre-tested dies requires post-bond interconnect testing, which is complex and costly. An imperfect TSV-based interconnect indicates a defective chip that should be rejected. Thus, it increases the yield loss and test cost. On the other hand, approximate computing (AC) is a promising design paradigm suitable for errorresilient applications, e.g., processi… Show more
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