1996
DOI: 10.1108/13565369610800368 View full text |Buy / Rent full text
|
|

Abstract: Taguchi methods were applied to the production of thin RF integrated circuits on alumina. The substrates had 20 via holes of 1 mm in diameter, which led to a perturbation to the homogeneous spread of photoresist (by spinning) adjacent to the holes. Consequently, the overall process yield was 30%. Implementation of Taguchi methods resulted in a substantial increase in production yield — to a value of 90%, which was obtained repeatedly. Thus, a robust cost‐effective process was achieved.

Help me understand this report

This publication either has no citations yet, or we are still processing them

Set email alert for when this publication receives citations?

See others like this or search for similar articles