An Ultra Low Power 3D Integrated Intra-Chip Silicon Electronic-Photonic Link

Timurdogan, Erman; Su, Zhan; Settaluri, Krishna T.; Lin, Sen; Moazeni, Sajjad; Sun, Chen; Leake, Gerald; Coolbaugh, Douglas; Moss, Benjamin; Moresco, M.; Stojanović, Vladimir; Watts, Michael R.

doi:10.1364/ofc.2015.th5b.8

Cited by 29 publications

(14 citation statements)

References 4 publications

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“…Work illustrating this capability has already been demonstrated by AIM Photonics members from MIT and SUNY Polyatechnic and UC Berkeley [1] and is illustrated in Figure 4 below. This wafer-scale CMOS-Silicon Photonics stacking was able to achieve Through-Oxide-Via (TOCV) face-to-face bonding with only ~1-to-2fF capacitance per contact, and pitch density of ~3μm with contact yields already > 99.999%.…”

Section: Examples Of Manufacturing Advancesmentioning

confidence: 92%

The American Institute for Manufacturing Integrated Photonics: advancing the ecosystem

et al. 2016

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The American Institute for Manufacturing Integrated Photonics (AIM Photonics) is focused on developing an end-to-end integrated photonics ecosystem in the U.S., including domestic foundry access, integrated design tools, automated packaging, assembly and test, and workforce development. This paper describes how the institute has been structured to achieve these goals, with an emphasis on advancing the integrated photonics ecosystem. Additionally, it briefly highlights several of the technological development targets that have been identified to provide enabling advances in the manufacture and application of integrated photonics.

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Section: Examples Of Manufacturing Advancesmentioning

confidence: 92%

The American Institute for Manufacturing Integrated Photonics: advancing the ecosystem

et al. 2016

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“…Such plasmonic modulators can be integrated with plasmonic detectors (e.g [19,20]. ), conventional detectors that are extremely compact as well and with electronics [3,[21][22][23], making them attractive transceivers for data center applications. Figure 1 illustrates two operation scenarios, with space-division multiplexing (SDM), Fig.…”

Section: Optical Interconnect Solutionmentioning

confidence: 99%

High speed plasmonic modulator array enabling dense optical interconnect solutions

Heni¹,

Hoessbacher²,

Haffner³

et al. 2015

Opt. Express

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Plasmonic modulators might pave the way for a new generation of compact low-power high-speed optoelectronic devices. We introduce an extremely compact transmitter based on plasmonic Mach-Zehnder modulators offering a capacity of 4 × 36 Gbit/s on a footprint that is only limited by the size of the high-speed contact pads. The transmitter array is contacted through a multicore fiber with a channel spacing of 50 μm.

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“…Planar and integrated optical interconnects with lasers, waveguides, modulators, detectors, and dispersive devices for wavelength division multiplexing are expected to pace with the rapidly increasing demand for high speed, high density data transmission [2]. While such complete integration is the most ideal embodiment, an out-of-plane optical coupler is a viable solution for semi-integrated optical interconnects for which external light sources are employed.…”

Section: Introductionmentioning

confidence: 99%

“…In this paper, we report a low NA and 1D laser direct writing for a 1 to 1 aspect ratio structure: a 45 degree mirror-based optical coupler, while keeping a high write rate of 2600 mm 2 /min. We demonstrate that simultaneous control of the mirror angle and surface figure is achievable even by using the low NA method.…”

Section: Introductionmentioning

confidence: 99%

Fast fabrication of polymer out-of-plane optical coupler by gray-scale lithography

Summitt¹,

Wang²,

Namnabat³

et al. 2017

Opt. Express

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Abstract:We report a fabrication process of a polymer, and mirror-based out-of-plane optical coupler. In the process, a pre-formed mirror blank made of a buffer coat material is reexposed by a laser direct writing tool with low numerical aperture of 0.1. The fabrication process is inherently fast because of the low numerical aperture (NA) process. The surface figure of the mirror is controlled under 0.04 waves in root-mean-square (RMS) at 1.55 μm wavelength, with mirror angle of 45 ± 1 degrees. Nominal insertion loss of 8.5dB of the mirror-based coupler was confirmed with polymer waveguides fabricated simultaneously.

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An Ultra Low Power 3D Integrated Intra-Chip Silicon Electronic-Photonic Link

Abstract: A record low energy (250fJ/bit) intra-chip electronic-photonic link is demonstrated at 5Gb/s on a 3D-integrated wafer using through-oxide-vias (1.45fF-per-via) for the first time. The receiver sensitivity was -19.3dBm and the on-chip laser energy was 6fJ/bit.

Cited by 29 publications

References 4 publications

The American Institute for Manufacturing Integrated Photonics: advancing the ecosystem

The American Institute for Manufacturing Integrated Photonics: advancing the ecosystem

High speed plasmonic modulator array enabling dense optical interconnect solutions

Fast fabrication of polymer out-of-plane optical coupler by gray-scale lithography

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