An Introduction of RoHS Legislation in SMD Thick-Film Hybrid Technology - a Case Study

Belavič, Darko; Rocak, Dubravka; Plut, Janeta Fajfar; Hrovat, Marko; Pavlic, J.; Drozd, Z.; Maček, Srečko; McGill, Ian; Bukat, K.

doi:10.1109/estc.2006.280086

Cited by 1 publication

(1 citation statement)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The studies of environment friendly technology [1,2,3,4,5,6,7,8,9,10,11], performed in Warsaw University of Technology (WUT) in frame of GreenRosE Project financed by EC, showed that critical problem is the assurance of the product reliability. For lead -free soldering three eutectic alloys were considered: SnCu (melting temperature 227°C) SnAg (221°C) and SnAgCu (217°C), however, at present, the SnAgCu (SAC) alloy is optimal because of relatively lowest process temperature.…”

Section: Introductionmentioning

confidence: 99%

Thermal and Mechanical Reliability Tests of Lead - free soldered SMT Joints

Drozd

Słoma

Kisiel

2007

2007 30th International Spring Seminar on Electronics Technology (ISSE)

View full text Add to dashboard Cite

One of the main goals in development of electronics manufacturing technology, after implementation of EU Directive RoHS, is the reliability improvement of electronic interconnection systems. Investigations of lead -free technologyfor small producers of electronic equipment (SME s) were made in Warsaw University of Technology (WUT) in frame of GreenRoSE Project financed by EC. Achieved results of accelerated thermal and mechanical cycling fatigue tests of SnPb3 7 and lead-free SMT solder joints are presented. Two PC test boards finishes. immersion tin and leadfree HASL were applied. The samples were assembled and soldered on GreenRoSE pilot line. Thermal cycling( air to air) tests were performed in two zone thermal shock chamber For mechanical tests was used new laboratory stand designed by WUT [1]. The failures occurred during the tests were detected by four point resistance measurements and visual inspection. The results showed that achieved reliability data of lead -free soldered joints are satisfactory, however, for high reliability applications, further investigations are necessary.

show abstract

Section: Introductionmentioning

confidence: 99%