An Intrinsically Microporous Network Polymer with Good Dielectric Properties at High Frequency

Abstract

An intrinsically microporous fluoropolymer has been successfully synthesized through thermo-cross-linking of a functional monomer having a quaternary carbon center and thermopolymerizable trifluorovinyl ether groups as the side chains. Because the monomer has a tetrahedral configuration, the thermo-cross-linking produces spontaneously formed micropores with an average size of 8 Å in the polymer. Because of the existence of the micropores, the fluoropolymer exhibits excellent dielectric properties with dielectric constant (D k ) of 2.36 and dissipation factor (D f ) of 1.29 × 10 −3 at a frequency of 5 GHz. Moreover, the polymer shows very low water uptake (<0.08% in water of 99 °C for 72 h) and high transparency (transmittance of 93% varying from 400 to 1100 nm). TGA and DMA data show that the polymer has 5 wt % loss temperature of 492 °C (in N 2 ) and Young's modulus of 4.95 GPa, respectively. These results suggest that the polymer is very suitable as the matrix resin for the production of the composites utilized in high-frequency printed circuit boards (HF-PCBs). In particular, this work is the first example for the production of a low D k and D f polymer using a strategy of spontaneously forming pores. Because HF-PCBs have a broad range of applications, this contribution is of considerable industrial importance.

Facile conversion of plant oil (anethole) to a high-performance material

“…In our case, D k of PM-BCB, which contains a biomass content of 56%, was measured via the standard capacitance method. 40 As illustrated in Fig. 6, an average D k of PM-BCB remains below 2.64 with an average dissipation factor (D f ) of less than 2 × 10 −3 in a range of frequencies from 0.1 to 30 MHz.…”

MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications

“…Most of polymer resins used in traditional low-frequency CCLs are epoxy and phenolic, which are hard to meet the demands of low dissipation factor in high-frequency and high-speed application field [ 2 ]. The dielectric loss of polymer is connected with the polarity of polymer molecules, the density of polar groups, and the mobility of polar groups [ 3 ]. Up to now, numerous polymeric composites are synthesized and analyzed for the potential application in electronics devices.…”

“…Up to now, numerous polymeric composites are synthesized and analyzed for the potential application in electronics devices. The resin matrices including modified epoxy resins, polytetrafluoroethylene (PTFE), cyanate ester (CE), polyimide resin (PI), polyphenylene ether (PPE), and other hydrocarbon resins [ 3 , 4 , 5 , 6 , 7 ]. Despite modified epoxy resins, CE and PI show relatively good dielectric and thermal properties, they still cannot meet the requirement of ultra-low dielectric loss (<0.003) at high-frequency.…”

Synthesis of polysiloxanes containing trifluoroethylene aryl ether groups: The effect of promoters

“…PFCB polymers are mainly prepared by the [2π + 2π] thermocyclization of trifluoroethylene aryl ether (TFVE) monomer . Recently, PFCB polymers have attracted extensive attention of researchers in various fields including electronics industry, aerospace, fuel cells, optical waveguide materials, and coatings because of the unique properties such as low dielectric property, low hygroscopicity, high thermal stability, chemical solvent resistance, and low birefringence. However, most of the research interests are focused on the functionality of PFCB group.…”