An experimental/numerical study of bonding mechanism in cold spray technology for metals

Recent advances on bonding mechanism in cold spray process: A review of single-particle impact methods

“…[ 101 ]); (c) the ballistic airgun for macroparticle impact (redrawn from Ref. [ 103 ]), and (d) the Laser-induced particle impact tester, LIPIT, and its corresponding typical multiframe sequences showing real-time observation of 45-μm Al particle impacting an Al substrate at 605 m/s (rebound) and 805 m/s (bonding), reprinted with permission from Ref. [ 104 ], copyright 2015 Elsevier.…”

“…3 (c). Here, the geometry, dimensions, and weight of the particle are defined to depict the nature of the powder particles being investigated [ 103 ]. A high-frequency camera is used for tracking, observing, and measuring the particle impact and rebound speeds.…”

“…A high-frequency camera is used for tracking, observing, and measuring the particle impact and rebound speeds. One disadvantage of this approach is that the physical and microstructural evolutions in ball-particles may not reflect actual evolutions during CS processing with more confined particle volume: the powder particles in CS (10–100 µm) are far smaller and lighter than the macroparticle balls (1.5–20 mm in diameter) used in this technique [ 29 , 103 ].…”

“… Method Materials combination and references Summarized contributions to bonding LIPIT Al/Al [ 104 ] Cu/Cu Ni/Ni Zn/Zn Jet formation and subsequent material fragmentation are directly linked to bonding Al/Al [ 112 ] Oxide layer composition, crystallinity, and thickness have significant influence on bonding Cu/Cu [ 114 ] Amorphous carbon and spherical copper oxides are additional barriers to bonding, in addition to the well-known surface native oxides Cu/Cu [ 50 ] Oxide layer delamination, in addition to oxide breakup contributes to clean metal–metal contact development. Jetting enhances the delamination process Ballistic airgun Pb/Pb [ 103 ] Bonding is promoted where jetting and melting occurred at regions of maximum equivalent plastic strain and temperature Wipe test Ti/AlMg 3 [ 23 ] Bonding is dominantly caused by shear instabilities under plastic deformation and to a less extent by the heat of friction Cu/Al [ 101 ] Mechanical adhesion is improved when both particle and substrate jet. High temperature and contact pressure at the interface improved bonding Ni/Stainless steel [ 145 ] High contact pressure is the dominant factor for metallurgical bonding FEM-CEL Cu/Cu [ 51 ] Jetting—a natural hydrodynamic effect that promotes bonding Molecular dynamics Cu/Cu [ 146 ] Impact-induced melting promotes bonding Cu/Cu [ 147 ] Surface oxide breakup to initiate metallurgical bonding Al/Al [ …”

Cold spray deposition of metallic coatings on polymers: a review

“…The bonding between the cold-sprayed powders and the metallic substrate has been extensively analysed in the literature [101,102]; the scientific community agrees in attributing the bonding process to two different mechanisms, known as mechanical interlocking and metallurgical bonding [103]. The former refers to the mechanical embedding of the particles into the substrate material without considering chemical interactions between the powder and the substrate.…”