2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2016
DOI: 10.1109/sispad.2016.7605169
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Advanced physical modeling of SiO<inf>x</inf> resistive random access memories

Abstract: Abstract-We apply a three-dimensional (3D) physical simulator, coupling self-consistently stochastic kinetic Monte Carlo descriptions of ion and electron transport, to investigate switching in silicon-rich silica (SiO x ) redox-based resistive random-access memory (RRAM) devices. We explain the intrinsic nature of resistance switching of the SiO x layer, and demonstrate the impact of self-heating effects and the initial vacancy distributions on switching. We also highlight the necessity of using 3D physical mo… Show more

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Cited by 7 publications
(10 citation statements)
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“…We employ an in-house 3D device simulator, which has been previously used for gaining insight into the operation of SiO x structures [3], [8], to study HfO x -based RRAMs, a widely used transition metal oxide (TMO) in memristor technology. Hafnia is highly suitable for high-density CMOS integration due to their high dielectric constants.…”
Section: Simulation Methodologymentioning
confidence: 99%
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“…We employ an in-house 3D device simulator, which has been previously used for gaining insight into the operation of SiO x structures [3], [8], to study HfO x -based RRAMs, a widely used transition metal oxide (TMO) in memristor technology. Hafnia is highly suitable for high-density CMOS integration due to their high dielectric constants.…”
Section: Simulation Methodologymentioning
confidence: 99%
“…The dynamic nature of the vacancy formation and annihilation, and electron trapping is considered accurately, as discussed rigorously in Refs. [3], [8], [12]. The ion and vacancy time-dependent dynamics (drift, diffusion, generation and recombination) are also modeled carefully, as discussed in Refs.…”
Section: Simulation Methodologymentioning
confidence: 99%
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