MRS Proc. 1998 DOI: 10.1557/proc-515-37 View full text
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J. M. Snodgrass, G. Hotchkiss, R. H. Dauskardt

Abstract: ABSTRACTTechniques are discussed for evaluating both critical interface adhesion values as well as the sub-critical debond behavior of polymer/silicon and polymer/polymer interfaces. Sub-critical debonding behavior is expected to be most relevant in predicting the in-service lifetime of microelectronic packages. Our research characterizes the debonding of a benzocyclobutene overlayer, as well as a technologically relevant epoxy underfill/polyimide/silicon interface system. Adhesion values are measured in a dou…

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