Active Thermal Control for Power Converters in Modular Winding Permanent Magnet Synchronous Motor

Yan, Hao; Buticchi, Giampaolo; Yang, Jiajun; Zhao, Weiduo; Zhang, He; Gerada, Chris

doi:10.1109/cpe.2019.8862416

Cited by 4 publications

(2 citation statements)

References 25 publications

(26 reference statements)

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“…In addition to the thermal control based load sharing technique, the power routing method is also adopted in the parallel converter system to balance the aging of converter cells. Similar to the power routing principle in the cascaded/modular converter system, the authors in [125,126] utilized power routing in parallel DC-DC converters system and two-level voltage source inverter (2L-VSI) in a triple modular permanent magnet synchronous motor (PMSM) drive system, respectively. The power routing method, based on the aging status of each converter cell in a parallel system, redistributes the power to each converter cell by adjusting the duty cycle to generate the switching patterns in the modulation stage.…”

Section: Parallel Converter Systemmentioning

confidence: 99%

Enhance Reliability of Semiconductor Devices in Power Converters

Nguyen¹,

Kwak²

2020

Electronics

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As one of the most vulnerable components to temperature and temperature cycling conditions in power electronics converter systems in these application fields as wind power, electric vehicles, drive system, etc., power semiconductor devices draw great concern in terms of reliability. Owing to the wide utilization of power semiconductor devices in various power applications, especially insulated gate bipolar transistors (IGBTs), power semiconductor devices have been studied extensively regarding increasing reliability methods. This study comparatively reviews recent advances in the area of reliability research for power semiconductor devices, including condition monitoring (CM), active thermal control (ATC), and remaining useful lifetime (RUL) estimation techniques. Different from previous review studies, this technical review is carried out with the aim of providing a comprehensive overview of the correlation between various enhancing reliability techniques and discussing the corresponding merits and demerits by using 144 related up-to-date papers. The structure and failure mechanism of power semiconductor devices are first investigated. Different failure indicators and recent associated CM techniques are then compared. The ATC approaches following the type of converter systems are further summarized. Furthermore, RUL estimation techniques are surveyed. This paper concludes with summarized challenges for future research opportunities regarding reliability improvement.

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Section: Parallel Converter Systemmentioning

confidence: 99%

Enhance Reliability of Semiconductor Devices in Power Converters

Nguyen¹,

Kwak²

2020

Electronics

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“…An initial version of the manuscript was presented at the IEEE CPE-POWERENG 2019 [22], with respect to the initial submission, this paper presents a deeper reliability study and an experimental verification of a multi-phase winding drive. The paper is organized as follows.…”

Section: Introductionmentioning

confidence: 99%