2012
DOI: 10.1109/tcad.2012.2208643 View full text |Buy / Rent full text
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Abstract: Localized heating leads to generation of thermal hotspots that affect the performance and reliability of an integrated circuit (IC). Functional workloads determine the locations and temperatures of hotspots on a die. In this paper, we present a systematic approach for developing a synthetic workload to maximize the temperature of a target hotspot. Our approach is based on the observation that hotspot temperature is determined not only by the current activity in that region, but also by the past activities in t… Show more

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