A universal structure for self-aligned in situ on-chip micro tensile fracture strength test

Li, Rui; Yang, Fang; He, Jun; Zhang, Li; Guan, Taotao; Fan, Zexin; Cheng, Leijian; Zhang, Dacheng

doi:10.1109/memsys.2017.7863489

Cited by 1 publication

(3 citation statements)

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“…The actual velocities are approximately the sam tained from FEM, which validates the simulation model. The shock tensile fracture strength is between 0.93 and 1.48 GPa, which is higher than the quasi-static tensile results [17]. The fracture surfaces are flat and show a tear texture, which is consistent with the characteristic of brittle materials.…”

Section: Resultssupporting

confidence: 62%

“…The process of manufacturing the tester in this paper is improved on the basis of our previous work [17]. The fabrication process is shown in Figure 8.…”

Section: Fabricationmentioning

confidence: 99%

“…Excitingly, this structure enables in situ shock tests to be directly loaded on the microstructure. Most on-chip tests study microstructure tensile fracture by probe [17], thermal actuator [18], and electrostatic actuator [19], but an on-chip shock test is a new concept. In recent years, although there has been a lot of studies on mechanical shock in MEMS, most of them have investigated the shock reliability of the device through shock testers.…”

Section: Introductionmentioning

confidence: 99%

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A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads

Zhang

2022

Micromachines

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In this paper, we propose a bistable shock structure based on the thermal actuation principle, which overcomes the response time limitation of heating and cooling in typical thermal actuators and enables a rapid release of energy. Thus, force with a steep rising edge can be applied on a target. Using a bistable shock structure to generate on-chip shock loads, we propose an automated and resettable method for shock testing of microstructures. We characterize the microscale shock process by high-speed camera and finite element simulation (FEM). The method can simulate the dynamic response of key structures in MEMS devices under mechanical shock conditions, and therefore, can be used to evaluate shock fracture strength of microstructures.

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Section: Resultssupporting

confidence: 62%

“…The process of manufacturing the tester in this paper is improved on the basis of our previous work [17]. The fabrication process is shown in Figure 8.…”

Section: Fabricationmentioning

confidence: 99%