2022 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS) 2022
DOI: 10.1109/eftf/ifcs54560.2022.9850808
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A Thermal-Stress FEM to Predict Aging in Packaged MEMS Resonators

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Cited by 3 publications
(1 citation statement)
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“…However this approach is purely experimental, statistic-heavy, and lacking of physical explanations. In [149] Segovia-Fernandez et al presented a novel accelerated aging test method based on the time-temperature superposition principle. The method models the relaxation of viscoelastic materials and their impact to package stress over time, then uses this information to predict the aging of DBAR oscillators.…”
Section: E Long-term Stabilitymentioning
confidence: 99%
“…However this approach is purely experimental, statistic-heavy, and lacking of physical explanations. In [149] Segovia-Fernandez et al presented a novel accelerated aging test method based on the time-temperature superposition principle. The method models the relaxation of viscoelastic materials and their impact to package stress over time, then uses this information to predict the aging of DBAR oscillators.…”
Section: E Long-term Stabilitymentioning
confidence: 99%