2021
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Abstract: High porosity metal foams offer large surface area per unit volume and have been considered as effective candidates for convection heat transfer enhancement, with applications as heat sinks in electronics cooling. In this paper, the research progress in thermo-hydraulic performance characterization of metal foams and their application as heat sinks for electronics cooling are reviewed. We focus on natural convection, forced convection, flow boiling, and solid/liquid phase change using phase change materials (P… Show more

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Cited by 12 publications
(4 citation statements)
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References 193 publications
(288 reference statements)
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“…During the past decades, the heat transfer phenomenon in CMs has received considerable attention. CMs have considerable applications in advanced thermal dissipation management systems, such as compact heat exchangers (Arasteh et al, 2019;Buonomo et al, 2020;Huisseune et al, 2015;Kotresha and Gnanasekaran, 2020;Sertkaya et al, 2012), thermal energy storages (Xu et al, 2020;Yang et al, 2019), electronics heat sinks (Li et al, 2021a(Li et al, , 2021b, and fuel cells (Dukhan and Hmad, 2022;Vazifeshenas et al, 2020), due to their high surface-to-volume ratio (SA:V) (from about 500 to over 10000 m 2 /m 3 ), highly conducting lattice frameworks, ultra-low weight with high strength characteristics and ability to create tortuous flow-paths to promote mixing and disturbance of the fluid flow. Consequently, the three-dimensional vortices, such as horseshoe and arch-shaped vortex, caused by the tortuous path followed by a fluid passing through the CM further augment heat transfer Fin-andelliptical tube heat exchanger (Kim et al, 2005;Liang et al, 2022).…”
Section: Periodic Cellular Lattice Structuresmentioning
confidence: 99%
“…Various computation-intensive studies have been performed in the past exploring the effect of fluid flow characteristics and the heat-transfer effects. The micro-cooling devices encompass the use of microchannels [2][3][4][5], porous materials [6], and microjets [7][8][9][10][11][12][13][14] with a promising future in all types of designs. However, each of them has its own set of challenges, from the design stage to the manufacturing stage.…”
Section: Introductionmentioning
confidence: 99%
“…In order to counter it, Samal and Moharana [15] provided a novel concept of recharging design of microchannel, which improves temperature uniformity and reduces back axial conduction. The porous materials have to tackle the challenge of the high-pressure drop [6]. The microjet impingement needs to deal with the problem of material erosion [16], but relaxes on the constraint of temperature non-uniformity and pressure drop.…”
Section: Introductionmentioning
confidence: 99%
“…However, they possess the low thermal conductivity especially organic PCMs [13]. Various strategies have been proposed to enhance the thermal conductivity of the PCM such as metallic fins [14,15,16,17,18,19,20,21], metallic foams [22,23,24,25], and nanoparticles [26,27,28,29,30,31] as thermal conductivity enhancers (TCEs) and micro/nano-encapsulation of PCMs [13,32,33,34,35]. Qu et al [22] conducted the numerical study for passive thermal management of high-power Li-ion battery using porous metal-foam with PCM.…”
mentioning
confidence: 99%