Compared with the nonphotosensitive polyimide, the photosensitive polyimide has become very important in the simplification of the patterning process. Its importance has prompted the development of a new type of photosensitive polyimide, using an alkaline aqueous solution as a developer. This photosensitive polyimide allows the formation of 40‐μm‐square via‐holes in a film with a thickness of 15 μm and exhibits excellent physical properties after curing.
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