A new method for hermeticity measurements using porous ultra low k dielectrics for sub-ppm moisture detection

Grange, H.; Danel, J.S.; Feldis, H.; Desloges, B.; Jousseaume, V.; Licitra, C.; Manquat, P. Brunet; Grosgeorges, P.; Fassi, B.; Sbiaa, Zouhair; Robert, P.

doi:10.1109/sensor.2009.5285536

Cited by 7 publications

(10 citation statements)

References 6 publications

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“…In that case, porosity and chemical composition are the main criteria. [3][4][5]47 For microelectronic application, the integration of highly porous materials as dielectric in integrated circuit interconnects presents a number of challenges due to their limited mechanical strength and their sensitivity to integration processes (in particular plasma etching). These issues are mainly related to the open and interconnected porosity.…”

Section: Resultsmentioning

confidence: 99%

Porous SiOCH Thin Films Obtained by Foaming

et al. 2016

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Porous organosilicate thin films (SiOCH) deposited by plasma-enhanced chemical vapor deposition (PECVD) are used as dielectric layers in advanced microelectronic interconnections and as chemical layers in chemical sensors and biosensors. One challenge is to increase the porosity in these films, the classical method being limited to porosity rate close to 50%. In this paper, we report an innovative and simple strategy to perform highly nanoporous SiOCH thin films without the use of any templates or external blowing agents. This approach uses a SiOCH deposited by PECVD (without any porogens) intentionally covered by a dense crust. The porosity generation is obtained through an ultraviolet (UV)-assisted thermal annealing of the stack. The highest porosities ever demonstrated for SiOCH PECVD thin films are obtained (porosity close to 65%). The impact of different process parameters (choice of precursor, deposition, and annealing conditions) on the creation of porosity is studied. The porosity introduction with this original method can be related to a foaming mechanism: a gas is produced inside the film during the UV-assisted curing which causes a film expansion and allow the creation of porosity.

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Section: Resultsmentioning

confidence: 99%

Porous SiOCH Thin Films Obtained by Foaming

et al. 2016

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“…Some of them are included in the industrial standards [1][2][3][4][5]. Many authors propose alternative solutions for methods used in the industry [6][7][8][9][10][11][12][13]. It is possible to divide those methods into two main groups.…”

Section: Introductionmentioning

confidence: 99%

“…The first group of methods uses different types of spectroscopy techniques: Fourier Transform Infrared Spectroscopy [6][7][8], Raman Spectroscopy [8], and near-infrared spectroscopy [9]. The second group of methods described in [10][11][12][13] uses different piezoelectric, resistive or capacitive internal structures of the component which monitor the changes of the internal pressure or the humidity increase inside the packaging. The thermoacoustic test method presented in this article may be considered as an example of a non-destructive alternative for destructive industrial hermeticity tests, especially for destructive gross leak detection methods such as a fluorocarbon bubble test or a dye penetrant liquid test included in standards [1][2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

The thermoacoustic method of determination of the air-tightness of metal transistors׳ packagings

Kubicki

Maliński

2014

Microelectronics Journal

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“…The main disadvantage of a majority of the methods included in the industrial standards is their destructivity, which limits their use only to the statistical approach. Many authors propose alternative solutions for the methods used in the industry [6][7][8][9][10][11][12][13]. It is possible to divide those methods into two main groups.…”

Section: Introductionmentioning

confidence: 99%

“…The first group of methods uses different types of spectroscopy techniques: Fourier transform infrared spectroscopy [6][7][8], Raman spectroscopy [8], and near-infrared spectroscopy [9]. The second group of methods described in [10][11][12][13] uses different piezoelectric, resistive, or capacitive internal structures of the component which monitor the changes of the internal pressure or the humidity increase inside of the package. The thermoacoustic test method presented in this article may be considered as an another example of a non-destructive alternative for destructive industrial hermeticity tests, especially for destructive gross leak detection methods such as a fluorocarbon bubble test or dye penetrant liquid test.…”

Section: Introductionmentioning

confidence: 99%

Modeling of Thermoacoustic Frequency Characteristics for the Air-Tightness Test Method

Kubicki

Maliński

2014

Int J Thermophys

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This paper is a description of theoretical models applied for the numerical interpretation of the experimental amplitude and phase frequency thermoacoustic characteristics observed for the transistor's packaging TO-39 with model holes of known radii in the packaging. They are essential from the point of view of determination of the sensitivity of the thermoacoustic method applied for the measurements of the air-tightness of packagings of electronic elements. In this paper, two models of the thermoacoustic signal are described, which are based on a transformation of the thermoacoustic effect to an electrical circuit: CRC and CRLC. Additionally, a method of extraction of the signal, coming from the hole in the packaging, from the total thermoacoustic signal, of the TO-39 packaging, is presented and discussed. The limitation of this method of detection of the air-tightness, caused by the thermoacoustic signal of the air-tight packaging, is also discussed.

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A new method for hermeticity measurements using porous ultra low k dielectrics for sub-ppm moisture detection

Cited by 7 publications

References 6 publications

Porous SiOCH Thin Films Obtained by Foaming

Porous SiOCH Thin Films Obtained by Foaming

The thermoacoustic method of determination of the air-tightness of metal transistors׳ packagings

Modeling of Thermoacoustic Frequency Characteristics for the Air-Tightness Test Method

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