2021
DOI: 10.1016/j.jmmm.2020.167661
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A micro-inductor with thin film magnetic core for a 20 MHz buck converter

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Cited by 10 publications
(3 citation statements)
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“…Figure a compares the performance, inductance density (L/area) vs Q/area, of the S‐RuM power inductors with conventional state‐of‐the‐art (SoA) micro‐inductors with similar sizes, frequencies, and application targets. [ 58–72 ] By this figure of merit, S‐RuM Cu plated inductors achieved very high Q per area due to resistance improvements of over 10x. The Q value of the 2‐cell, 5‐turn S‐RuM inductors (plotted in green) improved from 2 to 15 without changing the physical areal footprint of 0.15 mm 2 , allowing this device design to reach a higher Q per area than all other reported micro‐inductors.…”
Section: Integrated Plating Of Core and Shell In S‐rum Inductorsmentioning
confidence: 99%
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“…Figure a compares the performance, inductance density (L/area) vs Q/area, of the S‐RuM power inductors with conventional state‐of‐the‐art (SoA) micro‐inductors with similar sizes, frequencies, and application targets. [ 58–72 ] By this figure of merit, S‐RuM Cu plated inductors achieved very high Q per area due to resistance improvements of over 10x. The Q value of the 2‐cell, 5‐turn S‐RuM inductors (plotted in green) improved from 2 to 15 without changing the physical areal footprint of 0.15 mm 2 , allowing this device design to reach a higher Q per area than all other reported micro‐inductors.…”
Section: Integrated Plating Of Core and Shell In S‐rum Inductorsmentioning
confidence: 99%
“…Benchmark of S‐RuM electroplated inductors with conventional state‐of‐the‐art (SoA) inductors. a) Benchmark chart of L/area vs Q/area for three types of S‐RuM inductors against other SoA micro‐inductors recently reported in the literature: [ 58–72 ] (green) 2‐cell, 5‐turn, Cu plated devices; (yellow) 4‐cell, 15‐turn, Cu plated devices; (red) 4‐cell, 10‐turn, Cu shell and magnetic core plated devices (circle for control/unplated, star for plated). b) Comparison of S‐RuM devices of the same geometries with and without electroplating: (green) 2‐cell, 5‐turn, Cu plated devices showing significant resistance drop; (yellow) 4‐cell, 15‐turn, Cu plated devices showing significant resistance drop; (red) 4‐cell, 5‐turn, and (blue) 4‐cell 10‐turn, Cu shell and magnetic core plated devices, showing both significant resistance drops and inductance increases (circle for control/unplated, triangle for plated).…”
Section: Integrated Plating Of Core and Shell In S‐rum Inductorsmentioning
confidence: 99%
“…The flexible inductors are compared with the air-core planar inductors [34,35] and typical magnetic thin film inductors such as NiFe, [36,37] FeHfN, [38] FeTaN, [39] NiZnCuFeO, [40,41] NiZn, [42] and CoZrO. [43] Table 1 enumerates the materials, dimensions, inductance values, and inductance densities of inductors both from existing literature and those fabricated in this study.…”
Section: Performance Of Flexible Mini-inductorsmentioning
confidence: 99%