A micro-electroforming simulation model with dynamic diffusion coefficient for predicting void defects in microstructure

Ma, Zhigao; Jiang, Bingyan; Dong, Yanzhuo; Zhang, Lu

doi:10.1109/nanoman-aets56035.2022.10119467

2022 8th International Conference on Nanomanufacturing &Amp; 4th AET Symposium on ACSM and Digital Manufacturing (Nanoman-Aets) 2022

DOI: 10.1109/nanoman-aets56035.2022.10119467

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A micro-electroforming simulation model with dynamic diffusion coefficient for predicting void defects in microstructure

Zhigao Ma

Bingyan Jiang

Yanzhuo Dong

et al.

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A micro-electroforming simulation model with dynamic diffusion coefficient for predicting void defects in microstructure

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References 13 publications

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