A low cost approach to CSP based on meniscus bumping, laser bonding through flex and laser solder ball placement

Kallmayer, Christine; Azadeh, R.; Becker, Karl‐Friedrich; Anhock, S.; Busse, E.; Oppermann, Hermann; Azdasht, G.; Aschenbrenner, R.; Reichl, H.

doi:10.1109/eptc.1997.723882

Search citation statements

Order By: Relevance

Paper Sections

Select...

The Process For Gold Bump1

Introduction1

Citation Types

Supporting

Mentioning

Contrasting

Publication Types

Select...

Article1

Other1

Relationship

Self Cite0

Independent2

Authors

Journals

Cited by 2 publications

(2 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In this situation, the low cost wafer bumping process will be in demand. Currently, the technology is used for mass production by some manufacturers [3].…”

Section: The Process For Gold Bumpmentioning

confidence: 99%

See 1 more Smart Citation

Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process

Kang

Wong

et al. 2002

Semicond. Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…In this situation, the low cost wafer bumping process will be in demand. Currently, the technology is used for mass production by some manufacturers [3].…”

Section: The Process For Gold Bumpmentioning

confidence: 99%

“…• evaporation bumping process • electroplated bumping process • printing bumping process • solder stud bumping process 3 Author to whom any correspondence should be addressed.…”

Section: Introductionmentioning

confidence: 99%