2010
DOI: 10.1039/b924753j
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A facile route for irreversible bonding of plastic-PDMS hybrid microdevices at room temperature

Abstract: Plastic materials do not generally form irreversible bonds with poly(dimethylsiloxane) (PDMS) regardless of oxygen plasma treatment and a subsequent thermal process. In this paper, we perform plastic-PDMS bonding at room temperature, mediated by the formation of a chemically robust amine-epoxy bond at the interfaces. Various plastic materials, such as poly(methylmethacrylate) (PMMA), polycarbonate (PC), polyimide (PI), and poly(ethylene terephthalate) (PET) were adopted as choices for plastic materials. Irresp… Show more

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Cited by 249 publications
(244 citation statements)
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“…The poor adhesion between the two substrates results in leaks and, eventually, delamination of the PDMS structure from the substrate. Some strategies have been proposed for the irreversible bonding of PDMS and other plastic substrates 42,43 , however, on the basis of our initial experiments, it was not possible to achieve stable adhesion of PDMS and PaC using these protocols. A possible solution to this can be the complete removal of the PaC layer from the substrate, making the glass substrate available for O 2 plasma-mediated bonding with PDMS.…”
Section: Results and Discussion Flow Shear Stress Mechanical Stimulationmentioning
confidence: 93%
“…The poor adhesion between the two substrates results in leaks and, eventually, delamination of the PDMS structure from the substrate. Some strategies have been proposed for the irreversible bonding of PDMS and other plastic substrates 42,43 , however, on the basis of our initial experiments, it was not possible to achieve stable adhesion of PDMS and PaC using these protocols. A possible solution to this can be the complete removal of the PaC layer from the substrate, making the glass substrate available for O 2 plasma-mediated bonding with PDMS.…”
Section: Results and Discussion Flow Shear Stress Mechanical Stimulationmentioning
confidence: 93%
“…The two surfaces were aligned, brought into contact, and then bonded at room temperature for one hour. A strong amineepoxy bond was formed, which has been shown to withstand flow rates of several hundred channel volumes per hour [8].…”
Section: Methodsmentioning
confidence: 99%
“…1b, by chemically bonding the two materials [8]. Hydroxyl groups were first formed on the surfaces to be bonded by exposure to an O 2 -plasma (50 W, 1 minute).…”
Section: Methodsmentioning
confidence: 99%
“…Specifically, Figures 4(a)-4(c) illustrate the steps involved in bonding the PDMS connector to the PMMA substrates using the solvent bonding method. 15 In brief, a plasma machine [PDC-32G, Harrick Plasma, USA] was used to break the original polymer chains and create hydroxyl groups on the PMMA and PDMS surfaces (Figure 4(a)). Modified PDMS was then soaked in 1% (v/v) aqueous solutions of aminosilane (ATPES) to create amine functionalities, while the modified PMMA was soaked in 1% (v/v) aqueous solutions of epoxysilane (GTPES) to create epoxy functionalities (Figure 4(b)).…”
Section: B Chip Assemblymentioning
confidence: 99%