A Dual-28Gb/s Digital-Assisted Distributed Driver with CDR for Optical-DAC PAM4 Modulation in 40nm CMOS

Liao, Qiwen; Shang, Hu; He, Jiasong; Yin, Bozhi; Chiang, Patrick; Liu, Jian; Qi, Nan; Wu, Nanjian

doi:10.1109/rfic.2019.8701783

Cited by 7 publications

(1 citation statement)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Furthermore, distributed amplifier natively has wide bandwidth compared to lumped amplifier. Many works based on distributed amplifier structure have been reported, such as [65,155,163,[168][169][170][171][172][173][174], and [142]. The lumped driver is easy to implement but has limited bandwidth and modulation format.…”

Section: Current and Future Challengesmentioning

confidence: 99%

Co-packaged optics (CPO): status, challenges, and solutions

Tan

Liu³

et al. 2023

Front. Optoelectron.

Self Cite

View full text Add to dashboard Cite

Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology. Graphical Abstract

show abstract