2006
DOI: 10.1088/1742-6596/34/1/019
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A Comparison of Various magnetic thin films for the application of microscale magnetic components

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Cited by 5 publications
(3 citation statements)
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References 8 publications
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“…Various compositions of Ni-Co alloys such as Permalloy (Ni-20%), Invar alloy (Ni-64%Fe) and high strength Ni-Fe alloy can be used to produce micro sensor, micro actuators and other MEMS device [4,5]. David Flynn compared various microscale magnetic components and described a novel method to manufacture and assemble a Ni-20%Fe microinductor that is based on flipchip bonding [6]. The micro component fabricated with electroforming Ni-Co alloy could be integrated with other materials easily [7,8].…”
Section: Introductionmentioning
confidence: 99%
“…Various compositions of Ni-Co alloys such as Permalloy (Ni-20%), Invar alloy (Ni-64%Fe) and high strength Ni-Fe alloy can be used to produce micro sensor, micro actuators and other MEMS device [4,5]. David Flynn compared various microscale magnetic components and described a novel method to manufacture and assemble a Ni-20%Fe microinductor that is based on flipchip bonding [6]. The micro component fabricated with electroforming Ni-Co alloy could be integrated with other materials easily [7,8].…”
Section: Introductionmentioning
confidence: 99%
“…Various compositions of Ni-Co alloys such as Permalloy (Ni-20%), Invar alloy (Ni-64%Fe) and high strength Ni-Fe alloy can be used to produce micro sensor, micro actuators and other MEMS device [4,5]. David Flynn compared various microscale magnetic components and described a novel method to manufacture and assemble a Ni-20%Fe microconductor that is based on flip chip bonding [6]. The micro component fabricated with electroforming Ni-Co alloy could be integrated with other materials easily [7].…”
Section: Introductionmentioning
confidence: 99%
“…Various compositions of Ni-Fe alloys such as Permalloy (Ni-20%Fe), Invar alloy (Ni-64%Fe) and high strength Ni-Fe alloy can be used to produce micro sensor, micro actuators and other MEMS device [4,5]. David Flynn compared various microscale magnetic components and described a novel method to manufacture and assemble a Ni-20%Fe microinductor that is based on flipchip bonding [6]. The micro component fabricated with electroforming Ni-Fe alloy could be integrated with other materials easily [7,8].…”
Section: Introductionmentioning
confidence: 99%