1998
DOI: 10.1109/68.669247
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A compact integrated InP-based single-phasar optical crossconnect

Abstract: Abstract-The first integrated InP-based polarization independent optical crossconnect is reported. The device can crossconnect signals at four wavelengths independently from two input fibers to two output fibers. Total on-chip loss is less then 16 dB. Device size is 7 2 9 mm 2 .

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Cited by 48 publications
(17 citation statements)
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“…Here, we present an improved OXC processed on a CBEgrown wafer which is much more uniform than the MOVPEgrown wafers we used in our earlier OXC's [6], [7]. By using a dilated (or double-gate) switch scheme we also demonstrate an improvement of the crosstalk performance to better than 20 dB for both polarization states.…”
Section: Introductionmentioning
confidence: 85%
See 1 more Smart Citation
“…Here, we present an improved OXC processed on a CBEgrown wafer which is much more uniform than the MOVPEgrown wafers we used in our earlier OXC's [6], [7]. By using a dilated (or double-gate) switch scheme we also demonstrate an improvement of the crosstalk performance to better than 20 dB for both polarization states.…”
Section: Introductionmentioning
confidence: 85%
“…The first InP polarization independent WDM optical crossconnect (OXC) was reported by us [6] and used a single PHASAR for all (de)multiplex operations to prevent losses due to mismatch of the PHASAR responses. In this configuration however the performance of the device is limited by coherent signal-crosstalk beat noise [8] (worst case TM crosstalk 11 dB).…”
Section: Introductionmentioning
confidence: 99%
“…Like the shrinking of electronic building blocks allowing billions of elements on a single chip nanostructures in photonics opens similar integration perspectives [1]. Because the size of the components decrease, the propagation loss is no longer an obstacle allowing then the use of material never considered in the past.…”
Section: Introductionmentioning
confidence: 94%
“…P HASED-ARRAY demultiplexers [1] are important components in multiwavelength lasers (MWLs) [2], [3] and integrated wavelength-selective switches such as add-drop multiplexers (ADMs) [4] and optical crossconnects (OXCs) [5], [6]. The increasing amount of components integrated on a single chip results in severe demands on wafer uniformity and processing.…”
Section: Introductionmentioning
confidence: 99%