MRS Proc. 1998 DOI: 10.1557/proc-515-31 View full text
Y. B. Park, Jin Yu

Abstract: ABSTRACTThe popcorn cracking phenomenon of plastic IC packages during the reflow soldering was investigated by conducting the stress analysis of heat transfer and moisture diffusion. Vapor pressures at delaminated interfaces between the die pad and EMC(Epoxy molding compound) were calculated and mechanistic parameters such as energy release rate, stress intensity factor and phase angle were derived under various loading conditions; thermal, crack face vapor pressure and mixed loadings. It was shown that therma…

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