2023
DOI: 10.1016/j.jmapro.2022.12.035
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A cold spray-based novel manufacturing route for flexible electronics

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Cited by 6 publications
(3 citation statements)
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“…Next, the surface of the 3D-printed PLA part is metallized by using CS particle deposition technology. In the present study, the feedstock Tin (Sn) particles with a size range of 10-45 µm [20] were cold deposited on the 3D printed PLA surface through a CS system (Rus Sonic Inc., Model K205/407R, Russia), in which the deposition nozzle was mounted on a programmable robot arm (Kuka KR Agilus). The CS experimental setup is shown in Figure 2a, and further details regarding the experimental setup can be found in the authors' previous works [21][22][23].…”
Section: Methodsmentioning
confidence: 99%
“…Next, the surface of the 3D-printed PLA part is metallized by using CS particle deposition technology. In the present study, the feedstock Tin (Sn) particles with a size range of 10-45 µm [20] were cold deposited on the 3D printed PLA surface through a CS system (Rus Sonic Inc., Model K205/407R, Russia), in which the deposition nozzle was mounted on a programmable robot arm (Kuka KR Agilus). The CS experimental setup is shown in Figure 2a, and further details regarding the experimental setup can be found in the authors' previous works [21][22][23].…”
Section: Methodsmentioning
confidence: 99%
“…Cold spray (CS) particle deposition, also known as cold gas dynamic spray or cold spray additive manufacturing, is an emerging solid-state material consolidation technology for rapid metallization on target surfaces owing to its high deposition rate, strong adhesion strength, and low operating temperatures. ,,, In CS, the particle deposition is performed below the melting point of the sprayed feedstock material so that the process can avoid oxidation, minimize thermal degradation, and consume low energy without a need of high-temperature explosive gases and radiation, thereby making the CS as a green and safe surface deposition technology . Traditionally, in the CS process, as shown in Figure b, the micrometer-scale metal particles (e.g., copper, tin, zinc, etc.)…”
Section: Methodsmentioning
confidence: 99%
“…Based on the above-mentioned points, the CS technique has received special attention as a promising candidate for a surface modification method of various materials as it generates a minimal heat-affected zone in both the as-deposited material and substrate [ 5 ]. Copper (Cu) [ 6 ], Cu-based alloys [ 7 , 8 ], Al [ 9 ], Al-based alloys [ 10 , 11 ], Ni [ 12 ], Ni-based alloys [ 13 , 14 ], Ti-based alloys [ 15 , 16 ], Fe-based alloys [ 8 , 17 ], Sn [ 18 ], high or medium entropy alloys [ 19 , 20 ], and metal-based composites such as Cu-Al 2 O 3 [ 21 ], Al-SiC [ 22 ], Al-TiB 2 [ 23 ], Al-Al 2 O 3 [ 24 ], Ni-WC [ 25 ], etc., in the form of coatings or parts, have been successfully actualized by CS technology so far.…”
Section: Introductionmentioning
confidence: 99%