A 1006 element hybrid silicon pixel detector with strobed binary output

Anghinolfi, F.; Aspell, P.; Bass, K.; Beusch, W.; Bosisio, L.; Boutonnet, C.; Burger, P.; Campbell, M.; Chesi, E.; Claeys, Corneel; Clémens, J. C.; Solal, M.; Debusschere, I.; Delpierre, P.; Bari, D. Di; Dierickx, B.; Enz, Christian; Focardi, E.; Forti, F.; Gally, Yves; Gläser, M.; Gys, T.; Habrard, M.C.; Heijne, E.H.M.; Hermans, L.; Hurst, R. B.; Inzani, P.; Jæger, J.J.; Jarron, P.; Krummenacher, F.; Lemeilleur, F.; Lenti, V.; Manzari, V.; Meddeler, G.; Morando, M.; Munns, A.; Nava, F.; Navach, F.; Neyer, C.; Ottaviani, G.; Pellegrini, F.; Pengg, F.; Perego, Roberta; Pindo, M.; Potheau, R.; Quercigh, E.; Redaelli, N.; Rossi, L. P.; Sauvage, D.; Segato, G.; Simone, S.; Stefanini, G.; Tonelli, G.; Vanstraelen, G.; Vegni, G.; Verweij, H.; Viertel, G.; Waisbard, J.

doi:10.1109/23.159682

Cited by 91 publications

(27 citation statements)

References 7 publications

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“…The chip was again manufactured in the SACMOS3 technology, and after bump-bond assembly at GEC-Marconi in Caswell, the first particle tracks were measured at CERN on 20 October 1991. These measurements were presented at the 1991 Nuclear Science Symposium in Santa Fe [16], two years after those of the first chip. In the scientific community, with relatively modest resources long iteration times are typical, also because the design teams are involved in the development and testing of the full application system.…”

Section: The Earliest 'Micropattern' Pixel Detectorsmentioning

confidence: 99%

Gigasensors for an Attoscope: Catching Quanta in CMOS

Heijne

2008

IEEE Solid-State Circuits Newsl.

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Section: The Earliest 'Micropattern' Pixel Detectorsmentioning

confidence: 99%

Gigasensors for an Attoscope: Catching Quanta in CMOS

Heijne

2008

IEEE Solid-State Circuits Newsl.

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“…This photocathode is at 30 mm distance viewed by a 8 mm × 4.8 mm area silicon chip #3 , containing 1024 pixels of 75 µm × 500 µm size #4 . Each pixel is bump-bonded to its individual front-end electronics, composed of preamplifier, comparator, delay line, coincidence logic and memory element, providing a binary response to the photoelectrons [3,4] #5 . The pixels are readout in a parallel line mode #6 .…”

Section: Introductionmentioning

confidence: 99%

Position sensitive photon counting with an ISPA tube

D’Ambrosio

Gys

Leutz

et al. 1995

IEEE Trans. Nucl. Sci.

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“…A striking example of the use of combined semiconductor technologies is the hybrid pixel detector. It has been possible ~1990 to achieve integration of a true 2-dimensional (2D) sensor matrix of microscopically segmented silicon elements and a matching matrix of CMOS readout electronics [1]. Due to the miniaturization of the electrical capacitances the thousands of parallel amplifiers in such an integrated circuit achieve low noise (~100 e -rms) signal processing with ns precision for asynchronous MHz pulse rates.…”

Section: Semiconductor Technology and Physicsmentioning

confidence: 99%

Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology

Heijne¹

2005

Nuclear Instruments and Methods in Physics Research Section A:

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Several challenges for tracking with semiconductor detectors in the high rate environment of future elementary particle physics experiments are discussed, such as reduction of spurious hits and ambiguities and identification of short-lived 'messenger' particles inside jets. To meet these requirements the instrumentation increasingly calls on progress in microelectronics. Advanced silicon integration technology for 3D packaging now offers post-processing of CMOS such as wafer thinning to 50µm and through-wafer vias of <10µm. These technologies might be applied to create new tracking detectors which can handle vertexing under the difficult rate conditions. The sensor layers can be only ~50µm thick with low noise performance and better radiation hardness by using small volume pixels. Multi-layer sensors with integrated coincidence signal processing could discriminate real tracks from various sources of background. Even in a ~400µm thick 3D assembly the vectors of tracks can be determined in ~10 degree bins and this multi-voxel device is called 'vector detector'. The measured vectors can be used to associate the main tracks to their vertices in the interaction region at high luminosity colliders and to establish an on-line, first-level trigger signature. Nucl. Instr. Meth. A for Proceedings of STD5 Hiroshima,[14][15][16][17] The other presentations in the HDI session were by Unno on advanced multi-layer, fine-pitch substrates [9] and by Kwiatowski on a densely packed multi-sensor imaging module with high performance circuits connected to each sensor [10]. The present introductory paper focusses in sections 3, 4 and 5 on trends in semiconductor technologies that may lead to improvements in tracking performance over the next decade. The challenge is the ever higher rates that are under discussion for future upgrades of the hadron colliders, as well as in the high energy, high intensity electron-positron collider CLIC. Some details will be given in section 2. A proposal for the 'vector detector' based on pixels and HDI is finally described in section 6. Submitted toWith its hundreds of millions of tracking points the central region of a collider experiment has some resemblance to the earlier workhorses of particle physics: the liquid-filled bubble chamber or the gaseous time-projection chamber, in which multi-track events could be visualized. advantage of the semiconductor hybrid assembly is the potential to individually resolve and temporarily store micrometer scale space coordinates of tracks from collider interactions that succeed each other at 40MHz rate and with thousands of tracks in each beam crossing.A comparable example of a semiconductor development with significant impact on science is the Charge Coupled Device (CCD) which finds many applications in imaging for astronomy, biology, and also in particle tracking as described in these proceedings by Damerell [11]. The CCD can offer very small (~10µm) pixel dimensions in all directions, resulting in even lower noise and better precision. The CCD vertex ...

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A 1006 element hybrid silicon pixel detector with strobed binary output

Cited by 91 publications

References 7 publications

Gigasensors for an Attoscope: Catching Quanta in CMOS

Gigasensors for an Attoscope: Catching Quanta in CMOS

Position sensitive photon counting with an ISPA tube

Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology

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