The availability of on-chip non-volatile memory for advanced high-k-metal-gate CMOS technology nodes has been limited due to integration and scaling challenges as well as operational voltage incompatibilities, while its need continues to grow rapidly in modern high-performance systems. By exploiting intrinsic device self-heating enhanced charge trapping in as fabricated highk-metal-gate logic devices, we introduce a unique multipletime programmable embedded non-volatile memory element, called the 'charge trap transistor' (CTT), for high-kmetal-gate CMOS technologies. Functionality and feasibility of using CTT memory devices have been demonstrated on 22 nm planar and 14 nm FinFET technology platforms, including fully functional product prototype memory arrays. These transistor memory devices offer high density (∼0.144µm 2 /bit for 22 nm and ∼0.082µm 2 /bit for 14 nm technology), logic voltage compatible and low peak power operation (∼4mW), and excellent retention for a fully integrated and scalable embedded non-volatile memory without added process complexity or masks. Index Terms-High-k-metal-gate, CMOS, embedded non-volatile memory. I. INTRODUCTION T HERE is an ever-increasing need for on-chip memory in VLSI technologies. In this letter, we demonstrate the application of HfO 2 based high-k-metal-gate (HKMG) logic devices, called 'Charge Trap Transistors' (CTTs), as nonvolatile memory (NVM) elements for system-on-chip (SoC) applications in state-of-the-art CMOS technologies. Recently, we demonstrated that intrinsic self-heating enhanced charge trapping in HKMG devices can be used to achieve large and stable device threshold voltage (V T) shifts that are suitable Manuscript